PROTECTION OF ACTIVE LAYERS OF MEMORY CELLS DURING PROCESSING OF OTHER ELEMENTS

PROBLEM TO BE SOLVED: To properly remove surface oxidation from selected conductive bodies, while avoiding damaging a memory structure.SOLUTION: A method of fabricating an electronic structure comprises providing a conductive layer (102), providing a dielectric layer (100) over the conductive layer,...

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Hauptverfasser: STEVEN AVANZINO, IGOR SOKOLIK, SUZETTE K PANGRLE, NICHOLAS H TRIPSAS, JEFFREY A SHIELDS
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creator STEVEN AVANZINO
IGOR SOKOLIK
SUZETTE K PANGRLE
NICHOLAS H TRIPSAS
JEFFREY A SHIELDS
description PROBLEM TO BE SOLVED: To properly remove surface oxidation from selected conductive bodies, while avoiding damaging a memory structure.SOLUTION: A method of fabricating an electronic structure comprises providing a conductive layer (102), providing a dielectric layer (100) over the conductive layer, providing first and second openings (104, 106) penetrating the dielectric layer (100), providing first and second conductive bodies (108, 110) in the first and second openings (104, 106) respectively and in contact with the conductive layer (102), providing a memory structure (126) over the first conductive body (108), providing a protective element (134) over the memory structure (126), and performing processing on the second conductive body (110).
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title PROTECTION OF ACTIVE LAYERS OF MEMORY CELLS DURING PROCESSING OF OTHER ELEMENTS
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