HARDENABLE COMPOSITION, DICING-DIE BONDING TAPE, CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP WITH ADHESIVE LAYER
PROBLEM TO BE SOLVED: To provide a hardenable composition which exhibits an excellent adhesivity after hardened and a dicing-die bonding tape using the hardenable composition.SOLUTION: The hardenable composition includes an epoxy resin having polar groups, a hardener for the epoxy resin, and an acry...
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| creator | TAKEBE YOSHIYUKI |
| description | PROBLEM TO BE SOLVED: To provide a hardenable composition which exhibits an excellent adhesivity after hardened and a dicing-die bonding tape using the hardenable composition.SOLUTION: The hardenable composition includes an epoxy resin having polar groups, a hardener for the epoxy resin, and an acrylic resin containing epoxy groups. The acrylic resin containing epoxy groups has a weight average molecular weight of 10,000-400,000, and a glass transition temperature of not lower than 60°C. The dicing-die bonding tape 1 is provided with an adhesive layer 3 composed of the hardenable composition, and a base layer 4 laminated on one side 3a of the adhesive layer 3. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2011195712A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2011195712A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2011195712A3</originalsourceid><addsrcrecordid>eNqNi0EKwjAQRbtxIeodBtct2IqIy2kyNSNtUtJUcVWKxJVooV7CW5uCB3D1P_-_N48-Cq0kjXlJIExVm4YdGx2DZMH6mEgmyI2WoYPDmuJAaU1igqBxthWutWFFLaEip4wEU0CFui1wuiavoYqDJQNrLAjFNVzYKUCpqOEzQYlXsstodu8fo1_9chGtC3JCJX54dX4c-pt_-nd3qrNNmqaH3T7NcPsX9AX2az73</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HARDENABLE COMPOSITION, DICING-DIE BONDING TAPE, CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP WITH ADHESIVE LAYER</title><source>esp@cenet</source><creator>TAKEBE YOSHIYUKI</creator><creatorcontrib>TAKEBE YOSHIYUKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a hardenable composition which exhibits an excellent adhesivity after hardened and a dicing-die bonding tape using the hardenable composition.SOLUTION: The hardenable composition includes an epoxy resin having polar groups, a hardener for the epoxy resin, and an acrylic resin containing epoxy groups. The acrylic resin containing epoxy groups has a weight average molecular weight of 10,000-400,000, and a glass transition temperature of not lower than 60°C. The dicing-die bonding tape 1 is provided with an adhesive layer 3 composed of the hardenable composition, and a base layer 4 laminated on one side 3a of the adhesive layer 3.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES ; WORKING-UP</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111006&DB=EPODOC&CC=JP&NR=2011195712A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111006&DB=EPODOC&CC=JP&NR=2011195712A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKEBE YOSHIYUKI</creatorcontrib><title>HARDENABLE COMPOSITION, DICING-DIE BONDING TAPE, CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP WITH ADHESIVE LAYER</title><description>PROBLEM TO BE SOLVED: To provide a hardenable composition which exhibits an excellent adhesivity after hardened and a dicing-die bonding tape using the hardenable composition.SOLUTION: The hardenable composition includes an epoxy resin having polar groups, a hardener for the epoxy resin, and an acrylic resin containing epoxy groups. The acrylic resin containing epoxy groups has a weight average molecular weight of 10,000-400,000, and a glass transition temperature of not lower than 60°C. The dicing-die bonding tape 1 is provided with an adhesive layer 3 composed of the hardenable composition, and a base layer 4 laminated on one side 3a of the adhesive layer 3.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi0EKwjAQRbtxIeodBtct2IqIy2kyNSNtUtJUcVWKxJVooV7CW5uCB3D1P_-_N48-Cq0kjXlJIExVm4YdGx2DZMH6mEgmyI2WoYPDmuJAaU1igqBxthWutWFFLaEip4wEU0CFui1wuiavoYqDJQNrLAjFNVzYKUCpqOEzQYlXsstodu8fo1_9chGtC3JCJX54dX4c-pt_-nd3qrNNmqaH3T7NcPsX9AX2az73</recordid><startdate>20111006</startdate><enddate>20111006</enddate><creator>TAKEBE YOSHIYUKI</creator><scope>EVB</scope></search><sort><creationdate>20111006</creationdate><title>HARDENABLE COMPOSITION, DICING-DIE BONDING TAPE, CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP WITH ADHESIVE LAYER</title><author>TAKEBE YOSHIYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2011195712A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKEBE YOSHIYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKEBE YOSHIYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HARDENABLE COMPOSITION, DICING-DIE BONDING TAPE, CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP WITH ADHESIVE LAYER</title><date>2011-10-06</date><risdate>2011</risdate><abstract>PROBLEM TO BE SOLVED: To provide a hardenable composition which exhibits an excellent adhesivity after hardened and a dicing-die bonding tape using the hardenable composition.SOLUTION: The hardenable composition includes an epoxy resin having polar groups, a hardener for the epoxy resin, and an acrylic resin containing epoxy groups. The acrylic resin containing epoxy groups has a weight average molecular weight of 10,000-400,000, and a glass transition temperature of not lower than 60°C. The dicing-die bonding tape 1 is provided with an adhesive layer 3 composed of the hardenable composition, and a base layer 4 laminated on one side 3a of the adhesive layer 3.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES WORKING-UP |
| title | HARDENABLE COMPOSITION, DICING-DIE BONDING TAPE, CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING SEMICONDUCTOR CHIP WITH ADHESIVE LAYER |
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