COOLING MECHANISM

PROBLEM TO BE SOLVED: To provide a cooling mechanism capable of enhancing cooling efficiency of a film-deposition substrate. SOLUTION: The cooling mechanism 2 includes a lower surface cooling plate 21, a lifting mechanism 22 and an upper surface cooling plate 25. The cooling mechanism 2 cools a subs...

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Bibliographische Detailangaben
1. Verfasser:	MIYAZAKI YOSHIMASA
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a cooling mechanism capable of enhancing cooling efficiency of a film-deposition substrate. SOLUTION: The cooling mechanism 2 includes a lower surface cooling plate 21, a lifting mechanism 22 and an upper surface cooling plate 25. The cooling mechanism 2 cools a substrate 11 via a tray 32 by bringing the lower surface cooling plate 21 into contact with the tray 32 supporting the substrate 11. Thus, the substrate 11 is cooled by conducting heat to the lower surface cooling plate 21 via the tray 32 and a heat conducting member. COPYRIGHT: (C)2011,JPO&INPIT