SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND SEMICONDUCTOR LIGHT-EMITTING DEVICE USING THE SAME

SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND SEMICONDUCTOR LIGHT-EMITTING DEVICE USING THE SAME

PROBLEM TO BE SOLVED: To solve the problem, wherein regarding an LED chip capable to respond to various types of LEDs ranging from small to large size by changing the number of unit LED elements included in a single die, current density becomes very high due to high illuminance and accordingly, radi...

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1. Verfasser: HORIUCHI MEGUMI
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description PROBLEM TO BE SOLVED: To solve the problem, wherein regarding an LED chip capable to respond to various types of LEDs ranging from small to large size by changing the number of unit LED elements included in a single die, current density becomes very high due to high illuminance and accordingly, radiating of the heat becomes mandatory. SOLUTION: An LED chip 20 has in 2 rows by 2 columns a plurality of unit LED elements 40 each of which has an n electrode and p electrode on one surface. The n electrodes 23 are arranged at the center of the array region, and the p electrodes 24 are arranged at the corners. The 23 for the n electrodes and the negative electrode 14 for the circuit board are grouped together and connected to a thin wire, whereby it is possible to connect the p electrode 24 in contact with the heat generation source to a thick wire of the positive electrode 15, thereby ensuring an efficient heat radiation route. COPYRIGHT: (C)2011,JPO&INPIT
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SOLUTION: An LED chip 20 has in 2 rows by 2 columns a plurality of unit LED elements 40 each of which has an n electrode and p electrode on one surface. The n electrodes 23 are arranged at the center of the array region, and the p electrodes 24 are arranged at the corners. The 23 for the n electrodes and the negative electrode 14 for the circuit board are grouped together and connected to a thin wire, whereby it is possible to connect the p electrode 24 in contact with the heat generation source to a thick wire of the positive electrode 15, thereby ensuring an efficient heat radiation route. 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SOLUTION: An LED chip 20 has in 2 rows by 2 columns a plurality of unit LED elements 40 each of which has an n electrode and p electrode on one surface. The n electrodes 23 are arranged at the center of the array region, and the p electrodes 24 are arranged at the corners. The 23 for the n electrodes and the negative electrode 14 for the circuit board are grouped together and connected to a thin wire, whereby it is possible to connect the p electrode 24 in contact with the heat generation source to a thick wire of the positive electrode 15, thereby ensuring an efficient heat radiation route. 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SOLUTION: An LED chip 20 has in 2 rows by 2 columns a plurality of unit LED elements 40 each of which has an n electrode and p electrode on one surface. The n electrodes 23 are arranged at the center of the array region, and the p electrodes 24 are arranged at the corners. The 23 for the n electrodes and the negative electrode 14 for the circuit board are grouped together and connected to a thin wire, whereby it is possible to connect the p electrode 24 in contact with the heat generation source to a thick wire of the positive electrode 15, thereby ensuring an efficient heat radiation route. COPYRIGHT: (C)2011,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND SEMICONDUCTOR LIGHT-EMITTING DEVICE USING THE SAME
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