RESISTOR MOUNTING METHOD

PROBLEM TO BE SOLVED: To provide a resistor mounting method increasing the strength of bonding onto a mounting substrate. SOLUTION: In the resistor mounting method, a pair of current terminals 14 are bent that their root parts 14a are parallel to the mounting substrate 15 and their leading ends 14b...

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Bibliographische Detailangaben
1. Verfasser:	KONAKA HIROKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resistor mounting method increasing the strength of bonding onto a mounting substrate. SOLUTION: In the resistor mounting method, a pair of current terminals 14 are bent that their root parts 14a are parallel to the mounting substrate 15 and their leading ends 14b are orthogonal to the mounting substrate 15, the current terminal 14 is inserted into the through-hole 16 to connect a second electrode conductor 18 on a rear surface of the mounting substrate 15 with the leading end 14b of the current terminal 14, a pair of voltage measuring terminals 13 are protruded to be parallel to the mounting substrate 15 and to connect their leading ends 13b with a first electrode conductor 17 on an upper surface of the mounting substrate 15, and a metal layer 20 is provided in the mounting substrate 15 positioned between the voltage measuring terminal 13 and the second electrode conductor 18 facing the voltage measuring terminal 13. COPYRIGHT: (C)2011,JPO&INPIT