METHOD FOR MANUFACTURING ELECTROMAGNETIC WAVE SHIELDING MATERIAL

PROBLEM TO BE SOLVED: To improve the surface uniformity of surface resistivity when printing a conductive composition layer to be a conductor pattern layer with an electromagnetic wave shielding material, to reduce waste in material costs and processing costs of the conductive composition layer and...

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Hauptverfasser: OISHI EIJI, IMAIZUMI TAKEAKI, KIURA SHINYA
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creator OISHI EIJI
IMAIZUMI TAKEAKI
KIURA SHINYA
description PROBLEM TO BE SOLVED: To improve the surface uniformity of surface resistivity when printing a conductive composition layer to be a conductor pattern layer with an electromagnetic wave shielding material, to reduce waste in material costs and processing costs of the conductive composition layer and a conductive metal layer, and to speed up electrolytic plating. SOLUTION: After a printing process for printing a conductive composition layer 3 composed of conductive particles and binder resin as a conductive pattern layer 2 more widely than a predetermined width to produce a conductive composition layer printed matter 4, both side ends 4e in a width direction TD orthogonal to a printing direction PD are cut off and removed by a cutting blade 5 or the like in a cutting process, and a center of the remaining is used as an electromagnetic wave shielding material 10 having only the conductive pattern layer with the predetermined width on a transparent belt-shaped base material 1. Alternatively, when further performing an electrolytic plating process for forming a conductive metal layer 6 on the surface of the conductive composition layer by electrolytic plating so that the conductor pattern layer includes the conductive composition layer and the conductive metal layer, the electrolytic plating processing is performed after the cutting process. COPYRIGHT: (C)2011,JPO&INPIT
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2011166074A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2011166074A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2011166074A3</originalsourceid><addsrcrecordid>eNrjZHDwdQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXcPVxdQ4J8vd1dPdzDfF0Vgh3DHNVCPbwdPVxAUn7Ooa4Bnk6-vAwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDQ0NDMzMDcxNHY6IUAQAVxys-</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR MANUFACTURING ELECTROMAGNETIC WAVE SHIELDING MATERIAL</title><source>esp@cenet</source><creator>OISHI EIJI ; IMAIZUMI TAKEAKI ; KIURA SHINYA</creator><creatorcontrib>OISHI EIJI ; IMAIZUMI TAKEAKI ; KIURA SHINYA</creatorcontrib><description>PROBLEM TO BE SOLVED: To improve the surface uniformity of surface resistivity when printing a conductive composition layer to be a conductor pattern layer with an electromagnetic wave shielding material, to reduce waste in material costs and processing costs of the conductive composition layer and a conductive metal layer, and to speed up electrolytic plating. SOLUTION: After a printing process for printing a conductive composition layer 3 composed of conductive particles and binder resin as a conductive pattern layer 2 more widely than a predetermined width to produce a conductive composition layer printed matter 4, both side ends 4e in a width direction TD orthogonal to a printing direction PD are cut off and removed by a cutting blade 5 or the like in a cutting process, and a center of the remaining is used as an electromagnetic wave shielding material 10 having only the conductive pattern layer with the predetermined width on a transparent belt-shaped base material 1. Alternatively, when further performing an electrolytic plating process for forming a conductive metal layer 6 on the surface of the conductive composition layer by electrolytic plating so that the conductor pattern layer includes the conductive composition layer and the conductive metal layer, the electrolytic plating processing is performed after the cutting process. COPYRIGHT: (C)2011,JPO&amp;INPIT</description><language>eng</language><subject>ADVERTISING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CRYPTOGRAPHY ; DISPLAY ; DISPLAYING ; EDUCATION ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LABELS OR NAME-PLATES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS ; SEALS ; SIGNS</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110825&amp;DB=EPODOC&amp;CC=JP&amp;NR=2011166074A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110825&amp;DB=EPODOC&amp;CC=JP&amp;NR=2011166074A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OISHI EIJI</creatorcontrib><creatorcontrib>IMAIZUMI TAKEAKI</creatorcontrib><creatorcontrib>KIURA SHINYA</creatorcontrib><title>METHOD FOR MANUFACTURING ELECTROMAGNETIC WAVE SHIELDING MATERIAL</title><description>PROBLEM TO BE SOLVED: To improve the surface uniformity of surface resistivity when printing a conductive composition layer to be a conductor pattern layer with an electromagnetic wave shielding material, to reduce waste in material costs and processing costs of the conductive composition layer and a conductive metal layer, and to speed up electrolytic plating. SOLUTION: After a printing process for printing a conductive composition layer 3 composed of conductive particles and binder resin as a conductive pattern layer 2 more widely than a predetermined width to produce a conductive composition layer printed matter 4, both side ends 4e in a width direction TD orthogonal to a printing direction PD are cut off and removed by a cutting blade 5 or the like in a cutting process, and a center of the remaining is used as an electromagnetic wave shielding material 10 having only the conductive pattern layer with the predetermined width on a transparent belt-shaped base material 1. Alternatively, when further performing an electrolytic plating process for forming a conductive metal layer 6 on the surface of the conductive composition layer by electrolytic plating so that the conductor pattern layer includes the conductive composition layer and the conductive metal layer, the electrolytic plating processing is performed after the cutting process. COPYRIGHT: (C)2011,JPO&amp;INPIT</description><subject>ADVERTISING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CRYPTOGRAPHY</subject><subject>DISPLAY</subject><subject>DISPLAYING</subject><subject>EDUCATION</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LABELS OR NAME-PLATES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEALS</subject><subject>SIGNS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDwdQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXcPVxdQ4J8vd1dPdzDfF0Vgh3DHNVCPbwdPVxAUn7Ooa4Bnk6-vAwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDQ0NDMzMDcxNHY6IUAQAVxys-</recordid><startdate>20110825</startdate><enddate>20110825</enddate><creator>OISHI EIJI</creator><creator>IMAIZUMI TAKEAKI</creator><creator>KIURA SHINYA</creator><scope>EVB</scope></search><sort><creationdate>20110825</creationdate><title>METHOD FOR MANUFACTURING ELECTROMAGNETIC WAVE SHIELDING MATERIAL</title><author>OISHI EIJI ; IMAIZUMI TAKEAKI ; KIURA SHINYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2011166074A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>ADVERTISING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CRYPTOGRAPHY</topic><topic>DISPLAY</topic><topic>DISPLAYING</topic><topic>EDUCATION</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LABELS OR NAME-PLATES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEALS</topic><topic>SIGNS</topic><toplevel>online_resources</toplevel><creatorcontrib>OISHI EIJI</creatorcontrib><creatorcontrib>IMAIZUMI TAKEAKI</creatorcontrib><creatorcontrib>KIURA SHINYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OISHI EIJI</au><au>IMAIZUMI TAKEAKI</au><au>KIURA SHINYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MANUFACTURING ELECTROMAGNETIC WAVE SHIELDING MATERIAL</title><date>2011-08-25</date><risdate>2011</risdate><abstract>PROBLEM TO BE SOLVED: To improve the surface uniformity of surface resistivity when printing a conductive composition layer to be a conductor pattern layer with an electromagnetic wave shielding material, to reduce waste in material costs and processing costs of the conductive composition layer and a conductive metal layer, and to speed up electrolytic plating. SOLUTION: After a printing process for printing a conductive composition layer 3 composed of conductive particles and binder resin as a conductive pattern layer 2 more widely than a predetermined width to produce a conductive composition layer printed matter 4, both side ends 4e in a width direction TD orthogonal to a printing direction PD are cut off and removed by a cutting blade 5 or the like in a cutting process, and a center of the remaining is used as an electromagnetic wave shielding material 10 having only the conductive pattern layer with the predetermined width on a transparent belt-shaped base material 1. Alternatively, when further performing an electrolytic plating process for forming a conductive metal layer 6 on the surface of the conductive composition layer by electrolytic plating so that the conductor pattern layer includes the conductive composition layer and the conductive metal layer, the electrolytic plating processing is performed after the cutting process. COPYRIGHT: (C)2011,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
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subjects ADVERTISING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CRYPTOGRAPHY
DISPLAY
DISPLAYING
EDUCATION
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LABELS OR NAME-PLATES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
SEALS
SIGNS
title METHOD FOR MANUFACTURING ELECTROMAGNETIC WAVE SHIELDING MATERIAL
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