CUTTING DEVICE

PROBLEM TO BE SOLVED: To provide a cutting device which allows reduction of manufacturing cost by making a program for three-dimensionally operating a machining tool simple and inexpensive. SOLUTION: This cutting device includes a supporting means 4 supporting a machining head 2 on an upper side of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KUWABARA YOHEI, KAWAMURA TAKEHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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