RESIN SHEET FOR SEALING SEMICONDUCTOR, AND RESIN-SEALED SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a resin sheet for sealing semiconductor excellent in handleability and moldability, and to provide a resin-sealed semiconductor device which produces little warpage and is highly reliable. SOLUTION: A resin sheet for sealing semiconductor includes (A) a biphenyl type...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ANDO MOTOTAKE, FUKUKAWA HIROSHI, BUI DOUKU WIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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