SILICONE RESIN COMPOSITION AND UTILIZATION OF THE SAME

PROBLEM TO BE SOLVED: To provide a silicone resin composition that can control generation of bleeding without altering construction method and design. SOLUTION: The silicone resin composition is for adhering a minute electrical equipment system chip having a movable part to a substrate, and includes...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	FUKUHARA TOMOHIRO, TATSUNO YOSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a silicone resin composition that can control generation of bleeding without altering construction method and design. SOLUTION: The silicone resin composition is for adhering a minute electrical equipment system chip having a movable part to a substrate, and includes an one pack addition-type silicone resin that contains an organo polysiloxane having at least one vinyl group in the molecule, organo-hydrogenpolysiloxane having at least one H-Si bond in the molecule and platinum compound, and a porous filler. COPYRIGHT: (C)2011,JPO&INPIT