HEAT DISSIPATION DEVICE

HEAT DISSIPATION DEVICE

PROBLEM TO BE SOLVED: To facilitate adjusting operation during attachment of a heat dissipation device, and to improve heat dissipation efficiency of a heating element. SOLUTION: The heat dissipation device includes: a base portion (10) fixed to the heating element (100); a movable heat dissipation...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NAKAMURA HIROSHI, ABE HAYAMIZU, HASEGAWA YUJI, KOTAKA SATOSHI, HISADA KENGO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To facilitate adjusting operation during attachment of a heat dissipation device, and to improve heat dissipation efficiency of a heating element. SOLUTION: The heat dissipation device includes: a base portion (10) fixed to the heating element (100); a movable heat dissipation portion (20) which dissipates heat emitted from the heating element (100); first biasing mechanisms (36, 38) which bias the movable heat dissipation portion (20) toward the heating element (100); and second biasing mechanisms (34, 35) which bias the movable heat dissipation portion (20) toward the base portion (10), in a direction different from the biasing direction of the first biasing mechanisms (36, 38). COPYRIGHT: (C)2011,JPO&INPIT