PRINTED WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

PRINTED WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To form clear and discriminative symbols on the surface of a solder resist of a printed wiring board independent of silk printing and ink jet printing. SOLUTION: This invention relating to a method of manufacturing the printed wiring board comprises the steps of coating, for ex...

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Hauptverfasser: FUJISAKI YUICHI, UENO YUKIHIRO
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator FUJISAKI YUICHI
UENO YUKIHIRO
description PROBLEM TO BE SOLVED: To form clear and discriminative symbols on the surface of a solder resist of a printed wiring board independent of silk printing and ink jet printing. SOLUTION: This invention relating to a method of manufacturing the printed wiring board comprises the steps of coating, for example, a solder resist 13 with a thermosetting property on a base material surface (a surface of an outermost layer insulating layer 11 including an outermost layer wiring pattern 12) of a printed wiring board 10, performing half-drying or a half-curing of the coated solder resist 13, pressing a surface of the half-dried or half-cured solder resist 13 with a pressing jig for forming symbols expressing the information of the printed wiring board 10, and curing the pressed solder resist 13, wherein a depression character 14 of each symbol expressing the information of the printed wiring board 10 is formed on the surface of the solder resist 13 by changing the thickness of the solder resist 13. COPYRIGHT: (C)2011,JPO&INPIT
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SOLUTION: This invention relating to a method of manufacturing the printed wiring board comprises the steps of coating, for example, a solder resist 13 with a thermosetting property on a base material surface (a surface of an outermost layer insulating layer 11 including an outermost layer wiring pattern 12) of a printed wiring board 10, performing half-drying or a half-curing of the coated solder resist 13, pressing a surface of the half-dried or half-cured solder resist 13 with a pressing jig for forming symbols expressing the information of the printed wiring board 10, and curing the pressed solder resist 13, wherein a depression character 14 of each symbol expressing the information of the printed wiring board 10 is formed on the surface of the solder resist 13 by changing the thickness of the solder resist 13. 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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title PRINTED WIRING BOARD AND MANUFACTURING METHOD OF THE SAME
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