SUBSTRATE PROCESSING APPARATUS
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which uses a plurality of substrate holding tools and verifies a holding condition of a substrate even if the transfer/collection position is not just under the reaction furnace, collects a normal substrate from one substrate holding...
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| creator | TANIUCHI MASAMICHI |
| description | PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which uses a plurality of substrate holding tools and verifies a holding condition of a substrate even if the transfer/collection position is not just under the reaction furnace, collects a normal substrate from one substrate holding tool when the one substrate holding tool detects failure and also collects the normal substrate from the other substrate holding tool. SOLUTION: The substrate processing apparatus includes a plurality of substrate holding tools 21a, 21b to hold a substrate 7, a reaction furnace 11 for conducting a predetermined process to the substrate 7, a substrate transfer device 41 to transfer and collect the substrate 7 for the substrate holding tools 21a, 21b, an identifying means for identifying the substrate holding tools 21a, 21b, a detecting device for detecting the holding condition of the substrate 7, and a control device for controlling the substrate transfer device 41. When the detecting device detects failure with the substrate 7, the control device collects the substrate 7 with the substrate transfer device 41 based on the detected holding condition of the substrate 7 and the identification result of the identifying means. COPYRIGHT: (C)2011,JPO&INPIT |
| format | Patent |
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SOLUTION: The substrate processing apparatus includes a plurality of substrate holding tools 21a, 21b to hold a substrate 7, a reaction furnace 11 for conducting a predetermined process to the substrate 7, a substrate transfer device 41 to transfer and collect the substrate 7 for the substrate holding tools 21a, 21b, an identifying means for identifying the substrate holding tools 21a, 21b, a detecting device for detecting the holding condition of the substrate 7, and a control device for controlling the substrate transfer device 41. When the detecting device detects failure with the substrate 7, the control device collects the substrate 7 with the substrate transfer device 41 based on the detected holding condition of the substrate 7 and the identification result of the identifying means. 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SOLUTION: The substrate processing apparatus includes a plurality of substrate holding tools 21a, 21b to hold a substrate 7, a reaction furnace 11 for conducting a predetermined process to the substrate 7, a substrate transfer device 41 to transfer and collect the substrate 7 for the substrate holding tools 21a, 21b, an identifying means for identifying the substrate holding tools 21a, 21b, a detecting device for detecting the holding condition of the substrate 7, and a control device for controlling the substrate transfer device 41. When the detecting device detects failure with the substrate 7, the control device collects the substrate 7 with the substrate transfer device 41 based on the detected holding condition of the substrate 7 and the identification result of the identifying means. 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SOLUTION: The substrate processing apparatus includes a plurality of substrate holding tools 21a, 21b to hold a substrate 7, a reaction furnace 11 for conducting a predetermined process to the substrate 7, a substrate transfer device 41 to transfer and collect the substrate 7 for the substrate holding tools 21a, 21b, an identifying means for identifying the substrate holding tools 21a, 21b, a detecting device for detecting the holding condition of the substrate 7, and a control device for controlling the substrate transfer device 41. When the detecting device detects failure with the substrate 7, the control device collects the substrate 7 with the substrate transfer device 41 based on the detected holding condition of the substrate 7 and the identification result of the identifying means. COPYRIGHT: (C)2011,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | SUBSTRATE PROCESSING APPARATUS |
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