CIRCUIT MODULE, AND METHOD OF MOUNTING THE SAME

PROBLEM TO BE SOLVED: To provide a circuit module capable of preventing degradation of a solder joining property in a mounting process to achieve high-reliability mounting. SOLUTION: The circuit module 1 includes a circuit board 10 mounted with an element chip 20 at least on a first surface 10A being a main surface, and having a second surface 10B different from the first surface 10A; the circuit board is connected to a mounting board 100 through solder layers 30 with the second surface; the second surface includes electrical connection regions R1 each including a wiring conductor layer, and a physical connection region R2 formed separately from the electrical connection regions R1 for performing only physical connection without including a wiring conductor layer; the second surface is fixed to the mounting board 100 through the solder layers. COPYRIGHT: (C)2011,JPO&INPIT