SEMICONDUCTOR DEVICE, AND WIRE BONDING METHOD FOR THE SAME

SEMICONDUCTOR DEVICE, AND WIRE BONDING METHOD FOR THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor element where a bonding pad is joined to a finger while avoiding interference/contact between a capillary and a wire, and to provide a wire bonding method for the same. SOLUTION: This semiconductor element 10 includes an oblong semiconductor chip 14 i...

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1. Verfasser: KIDA TAKESHI
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description PROBLEM TO BE SOLVED: To provide a semiconductor element where a bonding pad is joined to a finger while avoiding interference/contact between a capillary and a wire, and to provide a wire bonding method for the same. SOLUTION: This semiconductor element 10 includes an oblong semiconductor chip 14 including bonding pads 12 and an oblong lead frame including fingers 16. The respective bonding pads 12 are joined to the respective fingers 16 through wires 20. The wires are sorted into a relatively short first wire group 20, and a relatively long second wire group (not illustrated). Bonding pad-side joining points of the first wire group 20 and those of the second wire group are shifted to positions close to an outer edge of the semiconductor chip 14 and positions away from the outer edge of the semiconductor chip 14, respectively. Consequently, interference of a previously-formed wire with a capillary can be avoided. COPYRIGHT: (C)2011,JPO&INPIT
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SOLUTION: This semiconductor element 10 includes an oblong semiconductor chip 14 including bonding pads 12 and an oblong lead frame including fingers 16. The respective bonding pads 12 are joined to the respective fingers 16 through wires 20. The wires are sorted into a relatively short first wire group 20, and a relatively long second wire group (not illustrated). Bonding pad-side joining points of the first wire group 20 and those of the second wire group are shifted to positions close to an outer edge of the semiconductor chip 14 and positions away from the outer edge of the semiconductor chip 14, respectively. Consequently, interference of a previously-formed wire with a capillary can be avoided. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR DEVICE, AND WIRE BONDING METHOD FOR THE SAME
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