SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To make a grease small in thickness under a lower load in connecting a semiconductor module with a housing via the grease on the other surface side of an insulating layer in the semiconductor module formed by: disposing a lead frame on one surface of the insulating layer; mount...

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1. Verfasser: WADO HIROYUKI
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description PROBLEM TO BE SOLVED: To make a grease small in thickness under a lower load in connecting a semiconductor module with a housing via the grease on the other surface side of an insulating layer in the semiconductor module formed by: disposing a lead frame on one surface of the insulating layer; mounting a circuit element on the lead frame; and molding them with a resin to expose the other surface of the insulating layer. SOLUTION: Protruded parts 11, 51 for radiating heat of the circuit elements 30, 31 are disposed at the same positions as an element mounting part 21 of the lead frame (20) on the other surface of the insulating layer 10 exposed from the resin 40. Parts around the protruded parts 11, 51 are recessed parts 12, 52 depressed from the protruded parts 11, 51 in the other surface of the insulating layer 10. COPYRIGHT: (C)2011,JPO&INPIT
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2011091259A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2011091259A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2011091259A3</originalsourceid><addsrcrecordid>eNrjZLAMdvX1dPb3cwl1DvEPUvD1dwn1cVVw9HNR8HUN8fB3UfB3U_B19At1c3QOCQ3y9HNXCPFwVQh29HXlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoaGBpaGRqaWjsZEKQIA2RkpGQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME</title><source>esp@cenet</source><creator>WADO HIROYUKI</creator><creatorcontrib>WADO HIROYUKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To make a grease small in thickness under a lower load in connecting a semiconductor module with a housing via the grease on the other surface side of an insulating layer in the semiconductor module formed by: disposing a lead frame on one surface of the insulating layer; mounting a circuit element on the lead frame; and molding them with a resin to expose the other surface of the insulating layer. SOLUTION: Protruded parts 11, 51 for radiating heat of the circuit elements 30, 31 are disposed at the same positions as an element mounting part 21 of the lead frame (20) on the other surface of the insulating layer 10 exposed from the resin 40. Parts around the protruded parts 11, 51 are recessed parts 12, 52 depressed from the protruded parts 11, 51 in the other surface of the insulating layer 10. COPYRIGHT: (C)2011,JPO&amp;INPIT</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110506&amp;DB=EPODOC&amp;CC=JP&amp;NR=2011091259A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110506&amp;DB=EPODOC&amp;CC=JP&amp;NR=2011091259A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WADO HIROYUKI</creatorcontrib><title>SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME</title><description>PROBLEM TO BE SOLVED: To make a grease small in thickness under a lower load in connecting a semiconductor module with a housing via the grease on the other surface side of an insulating layer in the semiconductor module formed by: disposing a lead frame on one surface of the insulating layer; mounting a circuit element on the lead frame; and molding them with a resin to expose the other surface of the insulating layer. SOLUTION: Protruded parts 11, 51 for radiating heat of the circuit elements 30, 31 are disposed at the same positions as an element mounting part 21 of the lead frame (20) on the other surface of the insulating layer 10 exposed from the resin 40. Parts around the protruded parts 11, 51 are recessed parts 12, 52 depressed from the protruded parts 11, 51 in the other surface of the insulating layer 10. COPYRIGHT: (C)2011,JPO&amp;INPIT</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAMdvX1dPb3cwl1DvEPUvD1dwn1cVVw9HNR8HUN8fB3UfB3U_B19At1c3QOCQ3y9HNXCPFwVQh29HXlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoaGBpaGRqaWjsZEKQIA2RkpGQ</recordid><startdate>20110506</startdate><enddate>20110506</enddate><creator>WADO HIROYUKI</creator><scope>EVB</scope></search><sort><creationdate>20110506</creationdate><title>SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME</title><author>WADO HIROYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2011091259A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WADO HIROYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WADO HIROYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME</title><date>2011-05-06</date><risdate>2011</risdate><abstract>PROBLEM TO BE SOLVED: To make a grease small in thickness under a lower load in connecting a semiconductor module with a housing via the grease on the other surface side of an insulating layer in the semiconductor module formed by: disposing a lead frame on one surface of the insulating layer; mounting a circuit element on the lead frame; and molding them with a resin to expose the other surface of the insulating layer. SOLUTION: Protruded parts 11, 51 for radiating heat of the circuit elements 30, 31 are disposed at the same positions as an element mounting part 21 of the lead frame (20) on the other surface of the insulating layer 10 exposed from the resin 40. Parts around the protruded parts 11, 51 are recessed parts 12, 52 depressed from the protruded parts 11, 51 in the other surface of the insulating layer 10. COPYRIGHT: (C)2011,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T21%3A41%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WADO%20HIROYUKI&rft.date=2011-05-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2011091259A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true