BONDING DEVICE

PROBLEM TO BE SOLVED: To provide a bonding device enabling both a simultaneous imaging of a semiconductor chip and a mounted part and a prevention of a bubble in a thin chip. SOLUTION: In the bonding device which bonds the semiconductor chip sucked by a suction head on an end of a bonding arm in a m...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TAKASU SEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!