METAL BASE CIRCUIT BOARD
PROBLEM TO BE SOLVED: To provide a metal base circuit board superior in thermal conductivity at low cost. SOLUTION: An insulating layer 102 is formed on a metal substrate 101 by using solvent-soluble liquid-crystal polyester. Further, a conductive foil 103 for forming a wiring pattern is formed on t...
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| creator | IWASE SADANOBU KONDO GOJI |
| description | PROBLEM TO BE SOLVED: To provide a metal base circuit board superior in thermal conductivity at low cost. SOLUTION: An insulating layer 102 is formed on a metal substrate 101 by using solvent-soluble liquid-crystal polyester. Further, a conductive foil 103 for forming a wiring pattern is formed on the insulating layer 102. A light emitting component such as a light emitting diode is mounted on the metal base circuit board. By using the liquid-crystal polyester, it is possible to achieve the insulating layer 102 having very high thermal conductivity. Consequently, it facilitates transfer of heat, generated in the light emitting component, to the metal substrate 101. Accordingly, it improves the heat-dissipation effect by the metal substrate 101. COPYRIGHT: (C)2011,JPO&INPIT |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2011077270A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2011077270A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2011077270A3</originalsourceid><addsrcrecordid>eNrjZJDwdQ1x9FFwcgx2VXD2DHIO9QxRcPJ3DHLhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoaGBubmRuYGjsZEKQIAEzMf0g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METAL BASE CIRCUIT BOARD</title><source>esp@cenet</source><creator>IWASE SADANOBU ; KONDO GOJI</creator><creatorcontrib>IWASE SADANOBU ; KONDO GOJI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a metal base circuit board superior in thermal conductivity at low cost. SOLUTION: An insulating layer 102 is formed on a metal substrate 101 by using solvent-soluble liquid-crystal polyester. Further, a conductive foil 103 for forming a wiring pattern is formed on the insulating layer 102. A light emitting component such as a light emitting diode is mounted on the metal base circuit board. By using the liquid-crystal polyester, it is possible to achieve the insulating layer 102 having very high thermal conductivity. Consequently, it facilitates transfer of heat, generated in the light emitting component, to the metal substrate 101. Accordingly, it improves the heat-dissipation effect by the metal substrate 101. COPYRIGHT: (C)2011,JPO&INPIT</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110414&DB=EPODOC&CC=JP&NR=2011077270A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110414&DB=EPODOC&CC=JP&NR=2011077270A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IWASE SADANOBU</creatorcontrib><creatorcontrib>KONDO GOJI</creatorcontrib><title>METAL BASE CIRCUIT BOARD</title><description>PROBLEM TO BE SOLVED: To provide a metal base circuit board superior in thermal conductivity at low cost. SOLUTION: An insulating layer 102 is formed on a metal substrate 101 by using solvent-soluble liquid-crystal polyester. Further, a conductive foil 103 for forming a wiring pattern is formed on the insulating layer 102. A light emitting component such as a light emitting diode is mounted on the metal base circuit board. By using the liquid-crystal polyester, it is possible to achieve the insulating layer 102 having very high thermal conductivity. Consequently, it facilitates transfer of heat, generated in the light emitting component, to the metal substrate 101. Accordingly, it improves the heat-dissipation effect by the metal substrate 101. COPYRIGHT: (C)2011,JPO&INPIT</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDwdQ1x9FFwcgx2VXD2DHIO9QxRcPJ3DHLhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoaGBubmRuYGjsZEKQIAEzMf0g</recordid><startdate>20110414</startdate><enddate>20110414</enddate><creator>IWASE SADANOBU</creator><creator>KONDO GOJI</creator><scope>EVB</scope></search><sort><creationdate>20110414</creationdate><title>METAL BASE CIRCUIT BOARD</title><author>IWASE SADANOBU ; KONDO GOJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2011077270A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>IWASE SADANOBU</creatorcontrib><creatorcontrib>KONDO GOJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IWASE SADANOBU</au><au>KONDO GOJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METAL BASE CIRCUIT BOARD</title><date>2011-04-14</date><risdate>2011</risdate><abstract>PROBLEM TO BE SOLVED: To provide a metal base circuit board superior in thermal conductivity at low cost. SOLUTION: An insulating layer 102 is formed on a metal substrate 101 by using solvent-soluble liquid-crystal polyester. Further, a conductive foil 103 for forming a wiring pattern is formed on the insulating layer 102. A light emitting component such as a light emitting diode is mounted on the metal base circuit board. By using the liquid-crystal polyester, it is possible to achieve the insulating layer 102 having very high thermal conductivity. Consequently, it facilitates transfer of heat, generated in the light emitting component, to the metal substrate 101. Accordingly, it improves the heat-dissipation effect by the metal substrate 101. COPYRIGHT: (C)2011,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | METAL BASE CIRCUIT BOARD |
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