INSPECTION DEVICE AND INSPECTION METHOD

PROBLEM TO BE SOLVED: To provide an inspection device and an inspection method capable of obtaining stable image data having high contrast between an alignment mark and a peripheral part even for a wafer with a film formed on the surface. SOLUTION: The defect inspection device includes a light source serving as illuminating light, an imaging optical system irradiating an object with light from the light source and condensing the reflection light and imaging, and an alignment measuring device disposed on the light condensing point of the imaging optical system, having a camera for photographing the image of the object and an image processing function for processing the photographed image where the image photographing is performed by the reflection light of at least two different wavelength bands, and the contrast of the alignment mark is enhanced by the proper calculation processing of the image information of the object corresponding to each reflection light. COPYRIGHT: (C)2011,JPO&INPIT