SURGE REMOVAL STRUCTURE OF MULTILAYER BOARD, AND ON-VEHICLE ELECTRONIC APPARATUS
PROBLEM TO BE SOLVED: To provide a surge removal structure of a multilayer board capable of protecting an electronic component mounted on a multilayer board from an external surge, and allowing the multilayer board to be downsized, and to provide an on-vehicle electronic apparatus. SOLUTION: The mul...
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| creator | YUKIMATSU KIKO |
| description | PROBLEM TO BE SOLVED: To provide a surge removal structure of a multilayer board capable of protecting an electronic component mounted on a multilayer board from an external surge, and allowing the multilayer board to be downsized, and to provide an on-vehicle electronic apparatus. SOLUTION: The multilayer board 21 includes a terminal connection part 29, an external connection part 28, a ground potential part 27, and a first electrode part 24. The external connection part 28 and the terminal connection part 29 are separated from each other at a distance ΔL4 in a first surface direction X. The external connection part 28 is connected to the first electrode part 24. The first electrode part 24 and the ground potential part 27 are separated from each other at a distance ΔL5 smaller than the distance ΔL4 in the thickness direction Z. An external surge input to the external connection part 28 advances from the external connection part 28 to the first electrode part 24, and discharged to the ground potential part 27 from the first electrode part 24. The multilayer board 21 can protect an electronic component 35 connected to the terminal connection part 29 from an external surge. Since the first electrode 24 is formed in the multilayer board 21, the multilayer board 21 can be downsized. COPYRIGHT: (C)2011,JPO&INPIT |
| format | Patent |
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SOLUTION: The multilayer board 21 includes a terminal connection part 29, an external connection part 28, a ground potential part 27, and a first electrode part 24. The external connection part 28 and the terminal connection part 29 are separated from each other at a distance ΔL4 in a first surface direction X. The external connection part 28 is connected to the first electrode part 24. The first electrode part 24 and the ground potential part 27 are separated from each other at a distance ΔL5 smaller than the distance ΔL4 in the thickness direction Z. An external surge input to the external connection part 28 advances from the external connection part 28 to the first electrode part 24, and discharged to the ground potential part 27 from the first electrode part 24. The multilayer board 21 can protect an electronic component 35 connected to the terminal connection part 29 from an external surge. Since the first electrode 24 is formed in the multilayer board 21, the multilayer board 21 can be downsized. 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SOLUTION: The multilayer board 21 includes a terminal connection part 29, an external connection part 28, a ground potential part 27, and a first electrode part 24. The external connection part 28 and the terminal connection part 29 are separated from each other at a distance ΔL4 in a first surface direction X. The external connection part 28 is connected to the first electrode part 24. The first electrode part 24 and the ground potential part 27 are separated from each other at a distance ΔL5 smaller than the distance ΔL4 in the thickness direction Z. An external surge input to the external connection part 28 advances from the external connection part 28 to the first electrode part 24, and discharged to the ground potential part 27 from the first electrode part 24. The multilayer board 21 can protect an electronic component 35 connected to the terminal connection part 29 from an external surge. Since the first electrode 24 is formed in the multilayer board 21, the multilayer board 21 can be downsized. 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SOLUTION: The multilayer board 21 includes a terminal connection part 29, an external connection part 28, a ground potential part 27, and a first electrode part 24. The external connection part 28 and the terminal connection part 29 are separated from each other at a distance ΔL4 in a first surface direction X. The external connection part 28 is connected to the first electrode part 24. The first electrode part 24 and the ground potential part 27 are separated from each other at a distance ΔL5 smaller than the distance ΔL4 in the thickness direction Z. An external surge input to the external connection part 28 advances from the external connection part 28 to the first electrode part 24, and discharged to the ground potential part 27 from the first electrode part 24. The multilayer board 21 can protect an electronic component 35 connected to the terminal connection part 29 from an external surge. Since the first electrode 24 is formed in the multilayer board 21, the multilayer board 21 can be downsized. COPYRIGHT: (C)2011,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | SURGE REMOVAL STRUCTURE OF MULTILAYER BOARD, AND ON-VEHICLE ELECTRONIC APPARATUS |
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