RESIST MATERIAL AND PATTERN FORMING METHOD USING THE SAME

PROBLEM TO BE SOLVED: To prevent shape defects of a pattern by improving the adhesiveness of a resist pattern with a film to be treated. SOLUTION: A resist film 302 formed from a resist containing a butane-1,4-sultam being a heterocyclic sulfone is formed on a substrate 301, and then the resist film...

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Hauptverfasser: ENDO MASATAKA, SASAKO MASARU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To prevent shape defects of a pattern by improving the adhesiveness of a resist pattern with a film to be treated. SOLUTION: A resist film 302 formed from a resist containing a butane-1,4-sultam being a heterocyclic sulfone is formed on a substrate 301, and then the resist film 302 is subjected to pattern exposure by selectively irradiating the resist film 302 with exposure light 303. Subsequently, the resist film subjected to the pattern exposure is developed to form a resist pattern 302a. COPYRIGHT: (C)2011,JPO&INPIT