SEMICONDUCTOR INTEGRATED DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor integrated device including a plurality of laminated semiconductor chips and having a sufficient signal transmission speed. SOLUTION: The semiconductor integrated device includes a plurality of semiconductor chips 11 each having a first internal circu...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: MORIMITSU HIROYUKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!