SEMICONDUCTOR INTEGRATED DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor integrated device including a plurality of laminated semiconductor chips and having a sufficient signal transmission speed. SOLUTION: The semiconductor integrated device includes a plurality of semiconductor chips 11 each having a first internal circuit 11a and a second internal circuit 11b and stacked while being displaced from each other. The first internal circuit 11a processes a data signal DATA in accordance with a predetermined process. The second internal circuit receives a request signal REQ from a transmission source and determines whether the request signal REQ is a request to itself or not, receives the data signal DATA from the transmission source and outputs the data signal DATA which is thus received to the first internal circuit when the request signal is the request to itself, transfers the request signal REQ to a transfer destination, receives the data signal DATA from the transmission source and transfers the data signal DATA which is thus received to the transfer destination when the request signal is not the request to itself. In one of the plurality of semiconductor chips 11, the transmission source is stacked on one side and the transfer destination is stacked on the other side. COPYRIGHT: (C)2011,JPO&INPIT