JUNCTION AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a junction which has improved junction characteristics and capable of maintaining the junction characteristics, even at a high-temperature high-humidity environment, and to provide a method of manufacturing the junction.SOLUTION: In the method of manufacturing the ju...

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Hauptverfasser:	KONISHI MISAO, NAMIKI HIDEJI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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creator	KONISHI MISAO NAMIKI HIDEJI
description	PROBLEM TO BE SOLVED: To provide a junction which has improved junction characteristics and capable of maintaining the junction characteristics, even at a high-temperature high-humidity environment, and to provide a method of manufacturing the junction.SOLUTION: In the method of manufacturing the junction, a first circuit member and a second circuit member are electrically joined via an anisotropic conductive film, and the first circuit member is a flexible printed board and when jointing it with the second circuit member, the flexible printed board the water content of which is 1.5 to 3.0 mass% is connected to the second circuit board.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2011018945A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2011018945A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2011018945A3</originalsourceid><addsrcrecordid>eNrjZND1CvVzDvH091Nw9HNR8HUN8fB3UfB3U_B19At1c3QOCQ3y9HNXCPFwVQh29HXlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoaGBoYWliamjsZEKQIA81YltA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>JUNCTION AND METHOD OF MANUFACTURING THE SAME</title><source>esp@cenet</source><creator>KONISHI MISAO ; NAMIKI HIDEJI</creator><creatorcontrib>KONISHI MISAO ; NAMIKI HIDEJI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a junction which has improved junction characteristics and capable of maintaining the junction characteristics, even at a high-temperature high-humidity environment, and to provide a method of manufacturing the junction.SOLUTION: In the method of manufacturing the junction, a first circuit member and a second circuit member are electrically joined via an anisotropic conductive film, and the first circuit member is a flexible printed board and when jointing it with the second circuit member, the flexible printed board the water content of which is 1.5 to 3.0 mass% is connected to the second circuit board.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110127&DB=EPODOC&CC=JP&NR=2011018945A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110127&DB=EPODOC&CC=JP&NR=2011018945A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KONISHI MISAO</creatorcontrib><creatorcontrib>NAMIKI HIDEJI</creatorcontrib><title>JUNCTION AND METHOD OF MANUFACTURING THE SAME</title><description>PROBLEM TO BE SOLVED: To provide a junction which has improved junction characteristics and capable of maintaining the junction characteristics, even at a high-temperature high-humidity environment, and to provide a method of manufacturing the junction.SOLUTION: In the method of manufacturing the junction, a first circuit member and a second circuit member are electrically joined via an anisotropic conductive film, and the first circuit member is a flexible printed board and when jointing it with the second circuit member, the flexible printed board the water content of which is 1.5 to 3.0 mass% is connected to the second circuit board.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND1CvVzDvH091Nw9HNR8HUN8fB3UfB3U_B19At1c3QOCQ3y9HNXCPFwVQh29HXlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoaGBoYWliamjsZEKQIA81YltA</recordid><startdate>20110127</startdate><enddate>20110127</enddate><creator>KONISHI MISAO</creator><creator>NAMIKI HIDEJI</creator><scope>EVB</scope></search><sort><creationdate>20110127</creationdate><title>JUNCTION AND METHOD OF MANUFACTURING THE SAME</title><author>KONISHI MISAO ; NAMIKI HIDEJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2011018945A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KONISHI MISAO</creatorcontrib><creatorcontrib>NAMIKI HIDEJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KONISHI MISAO</au><au>NAMIKI HIDEJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>JUNCTION AND METHOD OF MANUFACTURING THE SAME</title><date>2011-01-27</date><risdate>2011</risdate><abstract>PROBLEM TO BE SOLVED: To provide a junction which has improved junction characteristics and capable of maintaining the junction characteristics, even at a high-temperature high-humidity environment, and to provide a method of manufacturing the junction.SOLUTION: In the method of manufacturing the junction, a first circuit member and a second circuit member are electrically joined via an anisotropic conductive film, and the first circuit member is a flexible printed board and when jointing it with the second circuit member, the flexible printed board the water content of which is 1.5 to 3.0 mass% is connected to the second circuit board.</abstract><oa>free_for_read</oa></addata></record>
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subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
title	JUNCTION AND METHOD OF MANUFACTURING THE SAME
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T17%3A40%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KONISHI%20MISAO&rft.date=2011-01-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2011018945A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true