JUNCTION AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a junction which has improved junction characteristics and capable of maintaining the junction characteristics, even at a high-temperature high-humidity environment, and to provide a method of manufacturing the junction.SOLUTION: In the method of manufacturing the ju...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KONISHI MISAO, NAMIKI HIDEJI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a junction which has improved junction characteristics and capable of maintaining the junction characteristics, even at a high-temperature high-humidity environment, and to provide a method of manufacturing the junction.SOLUTION: In the method of manufacturing the junction, a first circuit member and a second circuit member are electrically joined via an anisotropic conductive film, and the first circuit member is a flexible printed board and when jointing it with the second circuit member, the flexible printed board the water content of which is 1.5 to 3.0 mass% is connected to the second circuit board.