METHOD FOR FORMING THERMAL SPLAY COATING
PROBLEM TO BE SOLVED: To provide a method for forming a thermal splay coating by which, when raw material powder is thermally sprayed on an objective face for film formation, the film formation is performed in such a manner that, in a liquid phase part contributing to the sticking of the raw materia...
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| creator | NINOMIYA YASUTOKU TOTOKAWA SHINJI YOSHIMURA KOZO ITO TOSHIKI TERA AKINOSUKE |
| description | PROBLEM TO BE SOLVED: To provide a method for forming a thermal splay coating by which, when raw material powder is thermally sprayed on an objective face for film formation, the film formation is performed in such a manner that, in a liquid phase part contributing to the sticking of the raw material powder to the objective face for film formation, the ratio is reduced and is left, and the ratio of a solid phase part is increased, thus high thermal conductivity is secured.SOLUTION: When raw material powder P is classified, and is thermally sprayed on the objective face for film formation, by alternately thermal-spraying large-sized powder Pb as a solid phase and perfectly melted small-sized powder Ps upon its arrival at the objective face for film formation, thermal spraying timing is controlled in such a manner that the large-sized powder Pb arrives at the objective face for film formation before the small-sized grain powder Ps is solidified. The ceramic film 10 to be deposited is solidified as a solid phase part 10Sp (about 50 to 90%, desirably 70 to 80%) and a liquid phase part 10Lp (about 10 to 50%, desirably 20 to 30%) with the small-sized powder Ps in a liquid phase state (melted state) as a binder. |
| format | Patent |
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The ceramic film 10 to be deposited is solidified as a solid phase part 10Sp (about 50 to 90%, desirably 70 to 80%) and a liquid phase part 10Lp (about 10 to 50%, desirably 20 to 30%) with the small-sized powder Ps in a liquid phase state (melted state) as a binder.</description><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110127&DB=EPODOC&CC=JP&NR=2011017078A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110127&DB=EPODOC&CC=JP&NR=2011017078A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NINOMIYA YASUTOKU</creatorcontrib><creatorcontrib>TOTOKAWA SHINJI</creatorcontrib><creatorcontrib>YOSHIMURA KOZO</creatorcontrib><creatorcontrib>ITO TOSHIKI</creatorcontrib><creatorcontrib>TERA AKINOSUKE</creatorcontrib><title>METHOD FOR FORMING THERMAL SPLAY COATING</title><description>PROBLEM TO BE SOLVED: To provide a method for forming a thermal splay coating by which, when raw material powder is thermally sprayed on an objective face for film formation, the film formation is performed in such a manner that, in a liquid phase part contributing to the sticking of the raw material powder to the objective face for film formation, the ratio is reduced and is left, and the ratio of a solid phase part is increased, thus high thermal conductivity is secured.SOLUTION: When raw material powder P is classified, and is thermally sprayed on the objective face for film formation, by alternately thermal-spraying large-sized powder Pb as a solid phase and perfectly melted small-sized powder Ps upon its arrival at the objective face for film formation, thermal spraying timing is controlled in such a manner that the large-sized powder Pb arrives at the objective face for film formation before the small-sized grain powder Ps is solidified. The ceramic film 10 to be deposited is solidified as a solid phase part 10Sp (about 50 to 90%, desirably 70 to 80%) and a liquid phase part 10Lp (about 10 to 50%, desirably 20 to 30%) with the small-sized powder Ps in a liquid phase state (melted state) as a binder.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDwdQ3x8HdRcPMPAmFfTz93hRAP1yBfRx-F4AAfx0gFZ3_HEKAoDwNrWmJOcSovlOZmUHJzDXH20E0tyI9PLS5ITE7NSy2J9wowMjA0NDA0NzC3cDQmShEARuMkbg</recordid><startdate>20110127</startdate><enddate>20110127</enddate><creator>NINOMIYA YASUTOKU</creator><creator>TOTOKAWA SHINJI</creator><creator>YOSHIMURA KOZO</creator><creator>ITO TOSHIKI</creator><creator>TERA AKINOSUKE</creator><scope>EVB</scope></search><sort><creationdate>20110127</creationdate><title>METHOD FOR FORMING THERMAL SPLAY COATING</title><author>NINOMIYA YASUTOKU ; TOTOKAWA SHINJI ; YOSHIMURA KOZO ; ITO TOSHIKI ; TERA AKINOSUKE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2011017078A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>NINOMIYA YASUTOKU</creatorcontrib><creatorcontrib>TOTOKAWA SHINJI</creatorcontrib><creatorcontrib>YOSHIMURA KOZO</creatorcontrib><creatorcontrib>ITO TOSHIKI</creatorcontrib><creatorcontrib>TERA AKINOSUKE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NINOMIYA YASUTOKU</au><au>TOTOKAWA SHINJI</au><au>YOSHIMURA KOZO</au><au>ITO TOSHIKI</au><au>TERA AKINOSUKE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR FORMING THERMAL SPLAY COATING</title><date>2011-01-27</date><risdate>2011</risdate><abstract>PROBLEM TO BE SOLVED: To provide a method for forming a thermal splay coating by which, when raw material powder is thermally sprayed on an objective face for film formation, the film formation is performed in such a manner that, in a liquid phase part contributing to the sticking of the raw material powder to the objective face for film formation, the ratio is reduced and is left, and the ratio of a solid phase part is increased, thus high thermal conductivity is secured.SOLUTION: When raw material powder P is classified, and is thermally sprayed on the objective face for film formation, by alternately thermal-spraying large-sized powder Pb as a solid phase and perfectly melted small-sized powder Ps upon its arrival at the objective face for film formation, thermal spraying timing is controlled in such a manner that the large-sized powder Pb arrives at the objective face for film formation before the small-sized grain powder Ps is solidified. The ceramic film 10 to be deposited is solidified as a solid phase part 10Sp (about 50 to 90%, desirably 70 to 80%) and a liquid phase part 10Lp (about 10 to 50%, desirably 20 to 30%) with the small-sized powder Ps in a liquid phase state (melted state) as a binder.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | METHOD FOR FORMING THERMAL SPLAY COATING |
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