EPOXY RESIN CURING AGENT AND EPOXY RESIN COMPOSITION
PROBLEM TO BE SOLVED: To provide an epoxy resin curing agent providing a cured product excellent in various physical properties such as coating film appearance, water resistance, adhesion, and low temperature curability.SOLUTION: This epoxy resin curing agent comprises the following polyamine compou...
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| creator | OGAWA TAKASHI KUWABARA HISAMASA |
| description | PROBLEM TO BE SOLVED: To provide an epoxy resin curing agent providing a cured product excellent in various physical properties such as coating film appearance, water resistance, adhesion, and low temperature curability.SOLUTION: This epoxy resin curing agent comprises the following polyamine compounds (A) and (B) and is produced by blending 100 pts.wt. of (A) and 5-50 pts.wt. of (B): (A) a polyamine compound which is a condensation-polymerization product of 1,3-bis(aminomethyl)cyclohexane, phenol and/or a phenol having a 1C-12C alkyl group, and formaldehyde, and in which the reaction ratio between 1,3-bis(aminomethyl)cyclohexane and phenol and/or a phenol having a 1C-12C alkyl group (=[amount of substance of phenol and/or a phenol having 1C-12C alkyl group]/[amount of substance of 1,3-bis(aminomethyl)cyclohexane]) is in a range of 0.9-1.5 and the reaction ratio between 1,3-bis(aminomethyl)cyclohexane and formaldehyde (=[amount of substance of formaldehyde]/[amount of substance of 1,3-bis(aminomethyl)cyclohexane]) is in a range of 0.5-1.2; and (B) a polyamine compound represented by the formula: (R)N-HC-A-CH-NHR (where A is a phenylene group; R is a hydrogen atom or a phenethyl group; and Rs may be the same as or different from each other and at least one of Rs is a phenethyl group). |
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and (B) a polyamine compound represented by the formula: (R)N-HC-A-CH-NHR (where A is a phenylene group; R is a hydrogen atom or a phenethyl group; and Rs may be the same as or different from each other and at least one of Rs is a phenethyl group).</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CORRECTING FLUIDS ; DYES ; FILLING PASTES ; INKS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES ; USE OF MATERIALS THEREFOR ; 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and (B) a polyamine compound represented by the formula: (R)N-HC-A-CH-NHR (where A is a phenylene group; R is a hydrogen atom or a phenethyl group; and Rs may be the same as or different from each other and at least one of Rs is a phenethyl group).</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBxDfCPiFQIcg329FNwDg3y9HNXcHR39QtRcPRzUUCR9PcN8A_2DPH09-NhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhoYGBmYmlpaOxkQpAgAimif5</recordid><startdate>20110113</startdate><enddate>20110113</enddate><creator>OGAWA TAKASHI</creator><creator>KUWABARA HISAMASA</creator><scope>EVB</scope></search><sort><creationdate>20110113</creationdate><title>EPOXY RESIN CURING AGENT AND EPOXY RESIN COMPOSITION</title><author>OGAWA TAKASHI ; KUWABARA HISAMASA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2011006499A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>OGAWA TAKASHI</creatorcontrib><creatorcontrib>KUWABARA HISAMASA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OGAWA TAKASHI</au><au>KUWABARA HISAMASA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EPOXY RESIN CURING AGENT AND EPOXY RESIN COMPOSITION</title><date>2011-01-13</date><risdate>2011</risdate><abstract>PROBLEM TO BE SOLVED: To provide an epoxy resin curing agent providing a cured product excellent in various physical properties such as coating film appearance, water resistance, adhesion, and low temperature curability.SOLUTION: This epoxy resin curing agent comprises the following polyamine compounds (A) and (B) and is produced by blending 100 pts.wt. of (A) and 5-50 pts.wt. of (B): (A) a polyamine compound which is a condensation-polymerization product of 1,3-bis(aminomethyl)cyclohexane, phenol and/or a phenol having a 1C-12C alkyl group, and formaldehyde, and in which the reaction ratio between 1,3-bis(aminomethyl)cyclohexane and phenol and/or a phenol having a 1C-12C alkyl group (=[amount of substance of phenol and/or a phenol having 1C-12C alkyl group]/[amount of substance of 1,3-bis(aminomethyl)cyclohexane]) is in a range of 0.9-1.5 and the reaction ratio between 1,3-bis(aminomethyl)cyclohexane and formaldehyde (=[amount of substance of formaldehyde]/[amount of substance of 1,3-bis(aminomethyl)cyclohexane]) is in a range of 0.5-1.2; and (B) a polyamine compound represented by the formula: (R)N-HC-A-CH-NHR (where A is a phenylene group; R is a hydrogen atom or a phenethyl group; and Rs may be the same as or different from each other and at least one of Rs is a phenethyl group).</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | EPOXY RESIN CURING AGENT AND EPOXY RESIN COMPOSITION |
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