SURFACE TREATMENT DEVICE
PROBLEM TO BE SOLVED: To provide a device for performing surface treatment to a surface of a workpiece having a groove or hole of a high aspect ratio.SOLUTION: The surface treatment device includes: a treatment chamber 3 for making a reactant gas chemically react with a surface of a workpiece 1; a r...
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| creator | HASEBE YUTA |
| description | PROBLEM TO BE SOLVED: To provide a device for performing surface treatment to a surface of a workpiece having a groove or hole of a high aspect ratio.SOLUTION: The surface treatment device includes: a treatment chamber 3 for making a reactant gas chemically react with a surface of a workpiece 1; a reactant gas-supplying part 6 for supplying the reactant gas to the treatment chamber through an introduction passage of the reactant gas; and a pressure variation part 8 for varying the pressure of the treatment chamber by supplying an introduction gas to the treatment chamber separately from the introduction passage of the reactant gas. The surface treatment device is structured such that the introduction gas is supplied to the treatment chamber from the pressure variation part 8 through an introduction gas-supplying part 7 by periodically varying the pressure of the introduction gas to high pressure and low pressure in the range of 6,666-101,325 Pa, and thereby the pressure in the treatment chamber is varied to run the reactant gas into/from the hole or groove 2. |
| format | Patent |
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The surface treatment device is structured such that the introduction gas is supplied to the treatment chamber from the pressure variation part 8 through an introduction gas-supplying part 7 by periodically varying the pressure of the introduction gas to high pressure and low pressure in the range of 6,666-101,325 Pa, and thereby the pressure in the treatment chamber is varied to run the reactant gas into/from the hole or groove 2.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110106&DB=EPODOC&CC=JP&NR=2011003744A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110106&DB=EPODOC&CC=JP&NR=2011003744A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HASEBE YUTA</creatorcontrib><title>SURFACE TREATMENT DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a device for performing surface treatment to a surface of a workpiece having a groove or hole of a high aspect ratio.SOLUTION: The surface treatment device includes: a treatment chamber 3 for making a reactant gas chemically react with a surface of a workpiece 1; a reactant gas-supplying part 6 for supplying the reactant gas to the treatment chamber through an introduction passage of the reactant gas; and a pressure variation part 8 for varying the pressure of the treatment chamber by supplying an introduction gas to the treatment chamber separately from the introduction passage of the reactant gas. 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The surface treatment device is structured such that the introduction gas is supplied to the treatment chamber from the pressure variation part 8 through an introduction gas-supplying part 7 by periodically varying the pressure of the introduction gas to high pressure and low pressure in the range of 6,666-101,325 Pa, and thereby the pressure in the treatment chamber is varied to run the reactant gas into/from the hole or groove 2.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | SURFACE TREATMENT DEVICE |
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