HEAT SINK, HEAT SINK COVER, ELECTRONIC MODULE, ELECTRONIC SUBSTRATE, AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To sufficiently cool an electronic component intended to be cooled by a heat sink even when a fin direction of a plate fin type heat sink is not set parallel to the direction of cooling air in terms of a device structure, and cooling performance of the plate fin type heat sink...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ISHIKURA MITSUO, TAMAYAMA NOBUHIRO, HAMAGISHI SHINYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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