WAFER PROCESSING DEVICE

PROBLEM TO BE SOLVED: To provide a wafer processing device which prevents a damage of a wafer, cassette, and transferring means. SOLUTION: The wafer processing device is provided with: a wafer cassette 50; a cassette mounting stand 74; and a transferring means 54 which brings a wafer into a cassette...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MATSUHASHI RYO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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