MULTIPLE PATTERNING CERAMIC WIRING BOARD

PROBLEM TO BE SOLVED: To provide a multiple patterning ceramic wiring board for an image sensor such as a CCD that improves flatness of a plane where a component such as an optical lens is mounted and suppresses production of dust due to ceramic crushing. SOLUTION: The multiple patterning ceramic wi...

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1. Verfasser: HORIE YUSAKU
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description PROBLEM TO BE SOLVED: To provide a multiple patterning ceramic wiring board for an image sensor such as a CCD that improves flatness of a plane where a component such as an optical lens is mounted and suppresses production of dust due to ceramic crushing. SOLUTION: The multiple patterning ceramic wiring board is manufactured such that a maximum isolation distance between a segment AB and a segment CD in a direction perpendicular to a board surface of a ceramic wiring board is ≤10 μm, where a segment connecting both ends A and B of an opening part of a groove formed for dividing into ceramic wiring boards is represented as AB and a segment connecting the points, which are 0.3 mm apart from the center O of the segment AB in a right/left direction or a front/rear direction and denoted as C and D, is represented as CD. COPYRIGHT: (C)2011,JPO&INPIT
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2010225910A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2010225910A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2010225910A3</originalsourceid><addsrcrecordid>eNrjZNDwDfUJ8QzwcVUIcAwJcQ3y8_RzV3B2DXL09XRWCPcMAnGd_B2DXHgYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBoYGRkamloYGjMVGKAFihJIM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MULTIPLE PATTERNING CERAMIC WIRING BOARD</title><source>esp@cenet</source><creator>HORIE YUSAKU</creator><creatorcontrib>HORIE YUSAKU</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a multiple patterning ceramic wiring board for an image sensor such as a CCD that improves flatness of a plane where a component such as an optical lens is mounted and suppresses production of dust due to ceramic crushing. SOLUTION: The multiple patterning ceramic wiring board is manufactured such that a maximum isolation distance between a segment AB and a segment CD in a direction perpendicular to a board surface of a ceramic wiring board is ≤10 μm, where a segment connecting both ends A and B of an opening part of a groove formed for dividing into ceramic wiring boards is represented as AB and a segment connecting the points, which are 0.3 mm apart from the center O of the segment AB in a right/left direction or a front/rear direction and denoted as C and D, is represented as CD. COPYRIGHT: (C)2011,JPO&amp;INPIT</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20101007&amp;DB=EPODOC&amp;CC=JP&amp;NR=2010225910A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20101007&amp;DB=EPODOC&amp;CC=JP&amp;NR=2010225910A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HORIE YUSAKU</creatorcontrib><title>MULTIPLE PATTERNING CERAMIC WIRING BOARD</title><description>PROBLEM TO BE SOLVED: To provide a multiple patterning ceramic wiring board for an image sensor such as a CCD that improves flatness of a plane where a component such as an optical lens is mounted and suppresses production of dust due to ceramic crushing. SOLUTION: The multiple patterning ceramic wiring board is manufactured such that a maximum isolation distance between a segment AB and a segment CD in a direction perpendicular to a board surface of a ceramic wiring board is ≤10 μm, where a segment connecting both ends A and B of an opening part of a groove formed for dividing into ceramic wiring boards is represented as AB and a segment connecting the points, which are 0.3 mm apart from the center O of the segment AB in a right/left direction or a front/rear direction and denoted as C and D, is represented as CD. COPYRIGHT: (C)2011,JPO&amp;INPIT</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDwDfUJ8QzwcVUIcAwJcQ3y8_RzV3B2DXL09XRWCPcMAnGd_B2DXHgYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBoYGRkamloYGjMVGKAFihJIM</recordid><startdate>20101007</startdate><enddate>20101007</enddate><creator>HORIE YUSAKU</creator><scope>EVB</scope></search><sort><creationdate>20101007</creationdate><title>MULTIPLE PATTERNING CERAMIC WIRING BOARD</title><author>HORIE YUSAKU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2010225910A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HORIE YUSAKU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HORIE YUSAKU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MULTIPLE PATTERNING CERAMIC WIRING BOARD</title><date>2010-10-07</date><risdate>2010</risdate><abstract>PROBLEM TO BE SOLVED: To provide a multiple patterning ceramic wiring board for an image sensor such as a CCD that improves flatness of a plane where a component such as an optical lens is mounted and suppresses production of dust due to ceramic crushing. SOLUTION: The multiple patterning ceramic wiring board is manufactured such that a maximum isolation distance between a segment AB and a segment CD in a direction perpendicular to a board surface of a ceramic wiring board is ≤10 μm, where a segment connecting both ends A and B of an opening part of a groove formed for dividing into ceramic wiring boards is represented as AB and a segment connecting the points, which are 0.3 mm apart from the center O of the segment AB in a right/left direction or a front/rear direction and denoted as C and D, is represented as CD. COPYRIGHT: (C)2011,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title MULTIPLE PATTERNING CERAMIC WIRING BOARD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-14T18%3A50%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HORIE%20YUSAKU&rft.date=2010-10-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2010225910A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true