MULTIPLE PATTERNING CERAMIC WIRING BOARD

PROBLEM TO BE SOLVED: To provide a multiple patterning ceramic wiring board for an image sensor such as a CCD that improves flatness of a plane where a component such as an optical lens is mounted and suppresses production of dust due to ceramic crushing. SOLUTION: The multiple patterning ceramic wi...

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Bibliographische Detailangaben
1. Verfasser:	HORIE YUSAKU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a multiple patterning ceramic wiring board for an image sensor such as a CCD that improves flatness of a plane where a component such as an optical lens is mounted and suppresses production of dust due to ceramic crushing. SOLUTION: The multiple patterning ceramic wiring board is manufactured such that a maximum isolation distance between a segment AB and a segment CD in a direction perpendicular to a board surface of a ceramic wiring board is ≤10 μm, where a segment connecting both ends A and B of an opening part of a groove formed for dividing into ceramic wiring boards is represented as AB and a segment connecting the points, which are 0.3 mm apart from the center O of the segment AB in a right/left direction or a front/rear direction and denoted as C and D, is represented as CD. COPYRIGHT: (C)2011,JPO&INPIT