METHOD OF MANUFACTURING PRINTED WIRING BOARD

METHOD OF MANUFACTURING PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To improve quality of a printed wiring board by eliminating lamination displacement between core materials superposed on each other when executing lamination press of a core laminate substrate of the printed wiring board. SOLUTION: In a process of lamination press of a printed...

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Hauptverfasser: TAKADA SHOSAKU, NANAUMI MASASHI, YAMAMOTO KENICHI
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator TAKADA SHOSAKU
NANAUMI MASASHI
YAMAMOTO KENICHI
description PROBLEM TO BE SOLVED: To improve quality of a printed wiring board by eliminating lamination displacement between core materials superposed on each other when executing lamination press of a core laminate substrate of the printed wiring board. SOLUTION: In a process of lamination press of a printed wiring board, a property of keeping a contact part to a lamination press device 9 flat and absorbing displacement and pressure in lamination press processing is provided to a structure of a core laminate substrate 11 comprising core materials 7 and a prepreg 8; lamination press is executed by a structure where shock-absorbing materials 13 easily separable from the structure of the core laminate substrate 11 are added on the upper and lower sides, whereby displacement in lamination between the core materials 7 superposed on each other and warpage of the core laminate substrate 11 are prevented. COPYRIGHT: (C)2011,JPO&INPIT
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title METHOD OF MANUFACTURING PRINTED WIRING BOARD
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