SUBSTRATE, AND SYSTEM AND METHOD FOR CONNECTING THE SAME

PROBLEM TO BE SOLVED: To achieve excellent electrical connection using a microstrip line, in inter-substrate connection of high-speed signal transmission of, for instance, tens of G bps or more. SOLUTION: This substrate includes: a dielectric layer; a microstrip signal line conductor arranged on a f...

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Bibliographische Detailangaben
Hauptverfasser:	UESUGI TOSHITSUGU, OKADA NORIO, ARIGA HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE SEMICONDUCTOR DEVICES WAVEGUIDES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To achieve excellent electrical connection using a microstrip line, in inter-substrate connection of high-speed signal transmission of, for instance, tens of G bps or more. SOLUTION: This substrate includes: a dielectric layer; a microstrip signal line conductor arranged on a first surface of the dielectric layer; and a ground conductor layer arranged on a second surface of the dielectric layer and constituting a microstrip line along with the microstrip signal line conductor. The length of the microstrip signal line conductor is larger or smaller than that of the ground conductor layer immediately below the microstrip signal line conductor. COPYRIGHT: (C)2010,JPO&INPIT