MEMS STRUCTURE, METHOD OF FABRICATING MEMS COMPONENT ON SEPARATE SUBSTRATE AND ASSEMBLY OF SEPARATE SUBSTRATE

PROBLEM TO BE SOLVED: To provide a microelectromechanical system (MEMS) device and method of fabricating the MEMS device. SOLUTION: There are disclosed methods of fabricating a microelectromechanical systems (MEMS) device with spacers between plates and MEMS devices formed by the same. In one embodi...

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Bibliographische Detailangaben
Hauptverfasser:	FLOYD PHILIP DON, SAMPSELL JEFFREY BRIAN, GALLY BRIAN JAMES
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a microelectromechanical system (MEMS) device and method of fabricating the MEMS device. SOLUTION: There are disclosed methods of fabricating a microelectromechanical systems (MEMS) device with spacers between plates and MEMS devices formed by the same. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. COPYRIGHT: (C)2010,JPO&INPIT