METHOD OF MANUFACTURING ELECTROFORMED COMPONENT USING LOW MELTING POINT METAL
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electroformed component by which an electroformed component is taken out from an electroforming die without deforming, dissolving and destroying the electroforming die. SOLUTION: The method of manufacturing an electroformed component incl...
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| creator | MURAZUMI TAKUYA NIWA TAKASHI SHIGESHIRO KOICHIRO CHIBA TAKETSUGU CHIBA TOKUO |
| description | PROBLEM TO BE SOLVED: To provide a method of manufacturing an electroformed component by which an electroformed component is taken out from an electroforming die without deforming, dissolving and destroying the electroforming die. SOLUTION: The method of manufacturing an electroformed component includes: a step where the electroforming die 420 is prepared; a step where a die cavity 420f is formed; a step where a resist layer 428 is provided on the surface of a metal thin film 424 excluding the inner part of the die cavity 420f: a step where a cavity low melting point metal layer 432 is formed in the inside of the die cavity 420f; a step where the electroformed component 430 is formed in the die cavity 420f: a step where the cavity low melting metal layer 432 is melted by heating the electroforming die 420 at a temperature equal to or above the melting point of the metal constituting the cavity low melting point metal layer 432: and a step where the electroformed component 430 is taken out from the die cavity 420f of the electroforming die 420. COPYRIGHT: (C)2010,JPO&INPIT |
| format | Patent |
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SOLUTION: The method of manufacturing an electroformed component includes: a step where the electroforming die 420 is prepared; a step where a die cavity 420f is formed; a step where a resist layer 428 is provided on the surface of a metal thin film 424 excluding the inner part of the die cavity 420f: a step where a cavity low melting point metal layer 432 is formed in the inside of the die cavity 420f; a step where the electroformed component 430 is formed in the die cavity 420f: a step where the cavity low melting metal layer 432 is melted by heating the electroforming die 420 at a temperature equal to or above the melting point of the metal constituting the cavity low melting point metal layer 432: and a step where the electroformed component 430 is taken out from the die cavity 420f of the electroforming die 420. 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| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES HOROLOGY MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL MECHANICALLY-DRIVEN CLOCKS OR WATCHES METALLURGY PHYSICS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS |
| title | METHOD OF MANUFACTURING ELECTROFORMED COMPONENT USING LOW MELTING POINT METAL |
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