METAL FILLER AND SOLDER PASTE

PROBLEM TO BE SOLVED: To provide a lead-free solder material which can be melted and joined at lower temperature conditions (peak temperature:≥150°C) than the mounting temperature (reflow heat treatment temperature)of Sn-37Pb eutectic solder, and can be repaired under the temperature conditions same...

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA NORIHITO, SHIRATORI GO
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a lead-free solder material which can be melted and joined at lower temperature conditions (peak temperature:≥150°C) than the mounting temperature (reflow heat treatment temperature)of Sn-37Pb eutectic solder, and can be repaired under the temperature conditions same as those of Sn-37Pb eutectic solder after the mounting. SOLUTION: The metal filler includes: first metal grains composed of an alloy having a composition containing, by mass, 5 to 15% Ag, 15 to 25% Bi, 10 to 20% Cu, 15 to 25% In and 15 to 55% Sn; and second metal grains composed of an alloy having a composition containing 25 to 40% Ag, 2 to 8% Bi, 5 to 15% Cu, 2 to 8% In and 29 to 66% Sn, and in which regarding the mixing ratio between the first metal grains and the second metal grains to the first metal grains 100 pts.mass, the ratio of the second metal grains is 90 to 110 pts.mass. COPYRIGHT: (C)2010,JPO&INPIT