METHOD OF MANUFACTURING POLYIMIDE LAMINATED SHEET
PROBLEM TO BE SOLVED: To provide an improved polyimide laminated sheet which can anew lead heat formed in a manufacturing process to other heat dispelling elements, can prevent superfluous heat which is produced between processes from accumulating in a polyimide film, and thereby can prevent deforma...
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| creator | HSU YEN-HUEY SON TOKUSO CHEN MING-HSIANG HU HSIU-YEH |
| description | PROBLEM TO BE SOLVED: To provide an improved polyimide laminated sheet which can anew lead heat formed in a manufacturing process to other heat dispelling elements, can prevent superfluous heat which is produced between processes from accumulating in a polyimide film, and thereby can prevent deformation of the film, and to provide a method of manufacturing the same. SOLUTION: In the disclosed method, a polyimide film having a thermally-conductive filler distributed homogenously therein is prepared, the polyimide film is characterized by having a thermal conductivity greater than 0.3 W/m°C. Then, at least one metal film is subsequently deposited on one or both sides of the polyimide film by electroplating, electroless plating, evaporation, sputtering or lamination and thereby forming the desired polyimide laminated plate. COPYRIGHT: (C)2010,JPO&INPIT |
| format | Patent |
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SOLUTION: In the disclosed method, a polyimide film having a thermally-conductive filler distributed homogenously therein is prepared, the polyimide film is characterized by having a thermal conductivity greater than 0.3 W/m°C. Then, at least one metal film is subsequently deposited on one or both sides of the polyimide film by electroplating, electroless plating, evaporation, sputtering or lamination and thereby forming the desired polyimide laminated plate. 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SOLUTION: In the disclosed method, a polyimide film having a thermally-conductive filler distributed homogenously therein is prepared, the polyimide film is characterized by having a thermal conductivity greater than 0.3 W/m°C. Then, at least one metal film is subsequently deposited on one or both sides of the polyimide film by electroplating, electroless plating, evaporation, sputtering or lamination and thereby forming the desired polyimide laminated plate. 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SOLUTION: In the disclosed method, a polyimide film having a thermally-conductive filler distributed homogenously therein is prepared, the polyimide film is characterized by having a thermal conductivity greater than 0.3 W/m°C. Then, at least one metal film is subsequently deposited on one or both sides of the polyimide film by electroplating, electroless plating, evaporation, sputtering or lamination and thereby forming the desired polyimide laminated plate. COPYRIGHT: (C)2010,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING |
| title | METHOD OF MANUFACTURING POLYIMIDE LAMINATED SHEET |
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