MULTIPLE PATTERNING WIRING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a multiple patterning wiring substrate which allows electronic components to be accurately mounted in respective wiring substrate regions and can be accurately divided into each wiring substrate region. SOLUTION: The multiple patterning wiring substrate includes a base substrate 1, the plurality of wiring substrate regions 1a arrayed longitudinally and laterally at a center portion of the base substrate 1, dummy regions 1b arranged around the plurality of wiring substrate regions respectively, a metalized layer 2 arranged at least on one principal surface of the dummy region 1b to surround the wiring board regions 1a, and a conductor 3 for plating electrically connected to the metalized layer 2. A plated coating can be bonded to a surface of the metalized layer 2 formed uniformly on the principal surface of the base substrate 1, curvature of which is reduced by stress of the plated coating. The electronic components can, therefore, be accurately mounted on the respective wiring substrate regions 1a, and accurately divided along outer edges of the respective wiring substrate regions 1a. COPYRIGHT: (C)2010,JPO&INPIT