SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING SEMICONDUCTOR MODULE, AND PORTABLE DEVICE

SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING SEMICONDUCTOR MODULE, AND PORTABLE DEVICE

PROBLEM TO BE SOLVED: To improve the connection reliability between an electrode that is provided in a semiconductor element and a bump electrode. SOLUTION: A semiconductor module 30 is provided with an element mounting substrate 10 and a semiconductor element 50 mounted thereon. The element mountin...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OKAYAMA YOSHIHISA, NAKAZATO MAYUMI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator OKAYAMA YOSHIHISA
NAKAZATO MAYUMI
description PROBLEM TO BE SOLVED: To improve the connection reliability between an electrode that is provided in a semiconductor element and a bump electrode. SOLUTION: A semiconductor module 30 is provided with an element mounting substrate 10 and a semiconductor element 50 mounted thereon. The element mounting substrate 10 includes an insulating resin layer 12, a wiring layer 14 provided on one main surface S1 of the insulating resin layer 12, and a bump electrode 16 that is electrically connected with the wiring layer 14 to project to the insulating resin layer 12 side from the wiring layer 14. The semiconductor element 50 has a semiconductor substrate 51 and an element electrode 52 opposed to each of the bump electrodes 16. Since the surface of the metal layer 55 provided on the element electrode 52 has an uneven shape, the adhesiveness with the insulating resin layer 12 is improved. COPYRIGHT: (C)2010,JPO&INPIT
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2010087229A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2010087229A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2010087229A3</originalsourceid><addsrcrecordid>eNrjZAgPdvX1dPb3cwl1DvEPUvD1dwn1cdVR8HUN8fB3UfB3U_B19At1c3QOCQ3y9HNXwK7a0c9FIcA_KMTRycdVwcU1zNPZlYeBNS0xpziVF0pzMyi5uYY4e-imFuTHpxYXJCan5qWWxHsFGBkYGhhYmBsZWToaE6UIADUMMXg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING SEMICONDUCTOR MODULE, AND PORTABLE DEVICE</title><source>esp@cenet</source><creator>OKAYAMA YOSHIHISA ; NAKAZATO MAYUMI</creator><creatorcontrib>OKAYAMA YOSHIHISA ; NAKAZATO MAYUMI</creatorcontrib><description>PROBLEM TO BE SOLVED: To improve the connection reliability between an electrode that is provided in a semiconductor element and a bump electrode. SOLUTION: A semiconductor module 30 is provided with an element mounting substrate 10 and a semiconductor element 50 mounted thereon. The element mounting substrate 10 includes an insulating resin layer 12, a wiring layer 14 provided on one main surface S1 of the insulating resin layer 12, and a bump electrode 16 that is electrically connected with the wiring layer 14 to project to the insulating resin layer 12 side from the wiring layer 14. The semiconductor element 50 has a semiconductor substrate 51 and an element electrode 52 opposed to each of the bump electrodes 16. Since the surface of the metal layer 55 provided on the element electrode 52 has an uneven shape, the adhesiveness with the insulating resin layer 12 is improved. COPYRIGHT: (C)2010,JPO&amp;INPIT</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100415&amp;DB=EPODOC&amp;CC=JP&amp;NR=2010087229A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100415&amp;DB=EPODOC&amp;CC=JP&amp;NR=2010087229A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKAYAMA YOSHIHISA</creatorcontrib><creatorcontrib>NAKAZATO MAYUMI</creatorcontrib><title>SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING SEMICONDUCTOR MODULE, AND PORTABLE DEVICE</title><description>PROBLEM TO BE SOLVED: To improve the connection reliability between an electrode that is provided in a semiconductor element and a bump electrode. SOLUTION: A semiconductor module 30 is provided with an element mounting substrate 10 and a semiconductor element 50 mounted thereon. The element mounting substrate 10 includes an insulating resin layer 12, a wiring layer 14 provided on one main surface S1 of the insulating resin layer 12, and a bump electrode 16 that is electrically connected with the wiring layer 14 to project to the insulating resin layer 12 side from the wiring layer 14. The semiconductor element 50 has a semiconductor substrate 51 and an element electrode 52 opposed to each of the bump electrodes 16. Since the surface of the metal layer 55 provided on the element electrode 52 has an uneven shape, the adhesiveness with the insulating resin layer 12 is improved. COPYRIGHT: (C)2010,JPO&amp;INPIT</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgPdvX1dPb3cwl1DvEPUvD1dwn1cdVR8HUN8fB3UfB3U_B19At1c3QOCQ3y9HNXwK7a0c9FIcA_KMTRycdVwcU1zNPZlYeBNS0xpziVF0pzMyi5uYY4e-imFuTHpxYXJCan5qWWxHsFGBkYGhhYmBsZWToaE6UIADUMMXg</recordid><startdate>20100415</startdate><enddate>20100415</enddate><creator>OKAYAMA YOSHIHISA</creator><creator>NAKAZATO MAYUMI</creator><scope>EVB</scope></search><sort><creationdate>20100415</creationdate><title>SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING SEMICONDUCTOR MODULE, AND PORTABLE DEVICE</title><author>OKAYAMA YOSHIHISA ; NAKAZATO MAYUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2010087229A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>OKAYAMA YOSHIHISA</creatorcontrib><creatorcontrib>NAKAZATO MAYUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OKAYAMA YOSHIHISA</au><au>NAKAZATO MAYUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING SEMICONDUCTOR MODULE, AND PORTABLE DEVICE</title><date>2010-04-15</date><risdate>2010</risdate><abstract>PROBLEM TO BE SOLVED: To improve the connection reliability between an electrode that is provided in a semiconductor element and a bump electrode. SOLUTION: A semiconductor module 30 is provided with an element mounting substrate 10 and a semiconductor element 50 mounted thereon. The element mounting substrate 10 includes an insulating resin layer 12, a wiring layer 14 provided on one main surface S1 of the insulating resin layer 12, and a bump electrode 16 that is electrically connected with the wiring layer 14 to project to the insulating resin layer 12 side from the wiring layer 14. The semiconductor element 50 has a semiconductor substrate 51 and an element electrode 52 opposed to each of the bump electrodes 16. Since the surface of the metal layer 55 provided on the element electrode 52 has an uneven shape, the adhesiveness with the insulating resin layer 12 is improved. COPYRIGHT: (C)2010,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2010087229A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING SEMICONDUCTOR MODULE, AND PORTABLE DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T12%3A48%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OKAYAMA%20YOSHIHISA&rft.date=2010-04-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2010087229A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true