CONDUCTING PARTICLES, ANISOTROPIC CONDUCTING MATERIAL AND CONNECTING STRUCTURE

CONDUCTING PARTICLES, ANISOTROPIC CONDUCTING MATERIAL AND CONNECTING STRUCTURE

PROBLEM TO BE SOLVED: To provide conducting particles that addresses the case where connection is made between electrodes to form a connecting structure, and in that case a connection resistance between the electrodes is hard to increase even if the connecting structure is exposed to high temperatur...

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Bibliographische Detailangaben
1. Verfasser: O GYOKA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
LINE CONNECTORS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide conducting particles that addresses the case where connection is made between electrodes to form a connecting structure, and in that case a connection resistance between the electrodes is hard to increase even if the connecting structure is exposed to high temperature and high humidity, and anisotropic conducting material and connecting structure using the conducting particles. SOLUTION: A conducting particle 1 includes a base particle 2, a nickel layer 3 formed on a surface 2a of the base particle 2, and a palladium layer 4 formed on a surface 3a of the nickel layer 3. A content rate of phosphorus in the nickel layer 3 is in a range of 5-15 wt.%, and a content rate of palladium in the palladium layer 4 is ≥96 wt.%. COPYRIGHT: (C)2010,JPO&INPIT