GYROSCOPE SENSOR AND METHOD FOR MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a gyroscope sensor which is excellent in the detection accuracy of an angular velocity, and especially enables its vibrator to be mounted to a package having a flat basal plane, and to provide a method for manufacturing the gyroscope sensor which enables an operation...
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| creator | IKEDA TAKESHI MORITA SUMUTO |
| description | PROBLEM TO BE SOLVED: To provide a gyroscope sensor which is excellent in the detection accuracy of an angular velocity, and especially enables its vibrator to be mounted to a package having a flat basal plane, and to provide a method for manufacturing the gyroscope sensor which enables an operation test to be carried out in such a multiple string state that a base of the vibrator is connected. SOLUTION: The gyroscope sensor includes: the vibrator 25 formed of an SOI substrate 33; and a package 40 for containing the vibrator 25. The vibrator 25 is configured to include: the base 17 and arms 15, 16 which are formed on an upper silicon substrate 13; and a pedestal 34 formed of a lower silicon substrate 11 below the base 17 through an insulating layer 12. The pedestal 34 is bonded to a package basal plane 40a, and an allowance space 41 for coping with the downward displacement of the arms is formed between the basal plane 40a and the arms 15, 16. COPYRIGHT: (C)2010,JPO&INPIT |
| format | Patent |
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SOLUTION: The gyroscope sensor includes: the vibrator 25 formed of an SOI substrate 33; and a package 40 for containing the vibrator 25. The vibrator 25 is configured to include: the base 17 and arms 15, 16 which are formed on an upper silicon substrate 13; and a pedestal 34 formed of a lower silicon substrate 11 below the base 17 through an insulating layer 12. The pedestal 34 is bonded to a package basal plane 40a, and an allowance space 41 for coping with the downward displacement of the arms is formed between the basal plane 40a and the arms 15, 16. 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SOLUTION: The gyroscope sensor includes: the vibrator 25 formed of an SOI substrate 33; and a package 40 for containing the vibrator 25. The vibrator 25 is configured to include: the base 17 and arms 15, 16 which are formed on an upper silicon substrate 13; and a pedestal 34 formed of a lower silicon substrate 11 below the base 17 through an insulating layer 12. The pedestal 34 is bonded to a package basal plane 40a, and an allowance space 41 for coping with the downward displacement of the arms is formed between the basal plane 40a and the arms 15, 16. 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| subjects | ELECTRICITY GYROSCOPIC INSTRUMENTS MEASURING MEASURING DISTANCES, LEVELS OR BEARINGS NAVIGATION PHOTOGRAMMETRY OR VIDEOGRAMMETRY PHYSICS SURVEYING TESTING |
| title | GYROSCOPE SENSOR AND METHOD FOR MANUFACTURING THE SAME |
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