CLADDING MATERIAL AND HEAT DISSIPATION SUBSTRATE USING THE SAME

PROBLEM TO BE SOLVED: To provide a material which has a high thermal conductivity equivalent to conventional cladding materials with a less thermal expansion coefficient. SOLUTION: The layer 11 is an outside Cu layer (outside layer:Cu layer), the layer 12 is an inside Cu layer (inside layer: Cu laye...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TSUSHIMA EIKI, TANABE KATSUMORI, YATSU TOMOYUKI, ONO ICHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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