SERVER DEVICE
PROBLEM TO BE SOLVED: To suppress the power consumption of a server device. SOLUTION: The invention relates to the server device including a management room 2, a plurality of server rooms 3a, 3b, 3c arranged in the management room 2, a plurality of servers arranged in the server rooms 3a, 3b, 3c, an...
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| creator | AKAIKE KAZUO KATSUMI YOSHIMASA |
| description | PROBLEM TO BE SOLVED: To suppress the power consumption of a server device. SOLUTION: The invention relates to the server device including a management room 2, a plurality of server rooms 3a, 3b, 3c arranged in the management room 2, a plurality of servers arranged in the server rooms 3a, 3b, 3c, and exhaust heat air courses 5a, 5b, 5c for sending air to the server rooms 3a, 3b, 3c, wherein vaporizing means 6a, 6b, 6c vaporize liquid at predetermined positions in the exhaust heat air courses 5a, 5b, 5c and vaporization heat of the liquid is used to lower temperatures in the exhaust heat air courses 5a, 5b, 5c of the server rooms 3a, 3b, 3c, thereby suppressing the power consumption for processing heat generation of the servers increasing in density. COPYRIGHT: (C)2010,JPO&INPIT |
| format | Patent |
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SOLUTION: The invention relates to the server device including a management room 2, a plurality of server rooms 3a, 3b, 3c arranged in the management room 2, a plurality of servers arranged in the server rooms 3a, 3b, 3c, and exhaust heat air courses 5a, 5b, 5c for sending air to the server rooms 3a, 3b, 3c, wherein vaporizing means 6a, 6b, 6c vaporize liquid at predetermined positions in the exhaust heat air courses 5a, 5b, 5c and vaporization heat of the liquid is used to lower temperatures in the exhaust heat air courses 5a, 5b, 5c of the server rooms 3a, 3b, 3c, thereby suppressing the power consumption for processing heat generation of the servers increasing in density. 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SOLUTION: The invention relates to the server device including a management room 2, a plurality of server rooms 3a, 3b, 3c arranged in the management room 2, a plurality of servers arranged in the server rooms 3a, 3b, 3c, and exhaust heat air courses 5a, 5b, 5c for sending air to the server rooms 3a, 3b, 3c, wherein vaporizing means 6a, 6b, 6c vaporize liquid at predetermined positions in the exhaust heat air courses 5a, 5b, 5c and vaporization heat of the liquid is used to lower temperatures in the exhaust heat air courses 5a, 5b, 5c of the server rooms 3a, 3b, 3c, thereby suppressing the power consumption for processing heat generation of the servers increasing in density. 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SOLUTION: The invention relates to the server device including a management room 2, a plurality of server rooms 3a, 3b, 3c arranged in the management room 2, a plurality of servers arranged in the server rooms 3a, 3b, 3c, and exhaust heat air courses 5a, 5b, 5c for sending air to the server rooms 3a, 3b, 3c, wherein vaporizing means 6a, 6b, 6c vaporize liquid at predetermined positions in the exhaust heat air courses 5a, 5b, 5c and vaporization heat of the liquid is used to lower temperatures in the exhaust heat air courses 5a, 5b, 5c of the server rooms 3a, 3b, 3c, thereby suppressing the power consumption for processing heat generation of the servers increasing in density. COPYRIGHT: (C)2010,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AIR-CONDITIONING, AIR-HUMIDIFICATION, VENTILATION, USE OF AIRCURRENTS FOR SCREENING BLASTING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PHYSICS PRINTED CIRCUITS RANGES VENTILATING WEAPONS |
| title | SERVER DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T13%3A31%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=AKAIKE%20KAZUO&rft.date=2010-02-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2010027700A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |