HEAT-DISSIPATING SUBSTRATE AND ITS MANUFACTURING METHOD, AND MODULE USING HEAT-DISSIPATING SUBSTRATE

PROBLEM TO BE SOLVED: To solve the problem, wherein in conventional heat-dissipating substrates, when the number or the like of heat-generating components to be mounted is increased, an area (for example, a projected area or a floor area) of a module is increased, thereby increasing the size of equi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUI NOBUYUKI, TANIGUCHI TOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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