PROBER

PROBLEM TO BE SOLVED: To provide a prober which keeps a position accuracy in a high temperature inspection without reducing a throughput. SOLUTION: A prober includes: a casing 11, 12; a wafer chuck 16 holding a wafer with a chip formed; a card holder 17 which holds a probe card 19 having a probe 20;...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HATA TETSUO, MOTOYAMA TAKASHI, MORIYAMA SATORU, MURAKAMI KONOSUKE, FUJITA TAICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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