MANUFACTURING METHOD OF MULTILAYER CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer circuit board hardly causing a crack in an insulation base material around a chip component, and capable of suppressing increase of manufacturing cost. SOLUTION: In this manufacturing method of a multilayer circuit board, throug...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KAMIYA HIROTERU, KONDO KOJI, SHIMIZU MOTONORI, TAKEUCHI SATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!