MANUFACTURING METHOD OF MULTILAYER CIRCUIT BOARD
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer circuit board hardly causing a crack in an insulation base material around a chip component, and capable of suppressing increase of manufacturing cost. SOLUTION: In this manufacturing method of a multilayer circuit board, throug...
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| creator | KAMIYA HIROTERU KONDO KOJI SHIMIZU MOTONORI TAKEUCHI SATOSHI |
| description | PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer circuit board hardly causing a crack in an insulation base material around a chip component, and capable of suppressing increase of manufacturing cost. SOLUTION: In this manufacturing method of a multilayer circuit board, through-holes H6a-H6d or conductor patterns are formed on a plurality of resin films 6a-6d, respectively, so that first distances A6a, A6d between end surfaces of resin films 6a, 6d in MD of one or more resin films 6a, 6d within a plurality of resin films 6a-6d, and an end surface of the chip component 3, or second distances between end surfaces of the conductor patterns 2 formed on the resin films and the end surface of the chip component 3 are set smaller than first distances A6b, A6c or the second distances in the MD of the other resin films 6b, 6c when the chip component 3 is inserted and arranged in a housing space S6 in a resin film preparation process. COPYRIGHT: (C)2010,JPO&INPIT |
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SOLUTION: In this manufacturing method of a multilayer circuit board, through-holes H6a-H6d or conductor patterns are formed on a plurality of resin films 6a-6d, respectively, so that first distances A6a, A6d between end surfaces of resin films 6a, 6d in MD of one or more resin films 6a, 6d within a plurality of resin films 6a-6d, and an end surface of the chip component 3, or second distances between end surfaces of the conductor patterns 2 formed on the resin films and the end surface of the chip component 3 are set smaller than first distances A6b, A6c or the second distances in the MD of the other resin films 6b, 6c when the chip component 3 is inserted and arranged in a housing space S6 in a resin film preparation process. 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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | MANUFACTURING METHOD OF MULTILAYER CIRCUIT BOARD |
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