SPUTTERING TARGET MATERIAL

PROBLEM TO BE SOLVED: To provide a sputtering target material in which target material pieces are surely joined to each other by reducing or eliminating the occurrence of a joining failure possibly arising when the target material pieces are subjected to friction stir welding. SOLUTION: The sputteri...

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Bibliographische Detailangaben
Hauptverfasser:	TONOKI TATSUYA, TATSUMI NORIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a sputtering target material in which target material pieces are surely joined to each other by reducing or eliminating the occurrence of a joining failure possibly arising when the target material pieces are subjected to friction stir welding. SOLUTION: The sputtering target material is formed by butting the plurality of sheets of the target material pieces 1 (1a, 1b) against each other, and joining butt parts by the friction stir welding 2 thereby forming the material to one sheet shape. The target material pieces 1 (1a, 1b) have engaging structures 3a, 3b fitting to each other in such a manner that the engaging structures 3a, 3b having projecting and recessing shape in the width direction of the target material pieces enable the target material pieces 1a and 1b to engage with each other. COPYRIGHT: (C)2010,JPO&INPIT