METHOD FOR MANUFACTURING WIRING BOARD HAVING BUILT-IN ELECTRIC ELEMENT

PROBLEM TO BE SOLVED: To obtain a wiring board having a built-in electric element, excellent in reliability in connection between a built-in electric element and a wiring circuit layer provided on the wiring board. SOLUTION: A method for manufacturing the wiring board having a built-in electric comp...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: IWACHI HIROMI, IINO YUJI, HAYASHI KATSURA
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator IWACHI HIROMI
IINO YUJI
HAYASHI KATSURA
description PROBLEM TO BE SOLVED: To obtain a wiring board having a built-in electric element, excellent in reliability in connection between a built-in electric element and a wiring circuit layer provided on the wiring board. SOLUTION: A method for manufacturing the wiring board having a built-in electric component includes: a step of laminating a first resin precursor sheet having a cavity, a second resin precursor sheet having a conductor and arranged on one main surface side of the first resin precursor sheet and a third resin precursor sheet arranged on the other main surface side of the first resin precursor sheet in a state where the electric element having an electrode connected to the conductor is arranged in the cavity on the one main surface; and a step of forming the first, second and third resin precursor sheets into first, second and third insulation layers respectively by heating and shrinking the first, second and third resin precursor sheets, and fixing the electric element on the second and third insulation layers. COPYRIGHT: (C)2009,JPO&INPIT
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2009212533A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2009212533A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2009212533A3</originalsourceid><addsrcrecordid>eNrjZHDzdQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXCPcEU07-jkEuCh6OYWBOqKdPiK6nn4Krj6tzSJCnM4jh6-oXwsPAmpaYU5zKC6W5GZTcXEOcPXRTC_LjU4sLEpNT81JL4r0CjAwMLI0MjUyNjR2NiVIEAP2sLKE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR MANUFACTURING WIRING BOARD HAVING BUILT-IN ELECTRIC ELEMENT</title><source>esp@cenet</source><creator>IWACHI HIROMI ; IINO YUJI ; HAYASHI KATSURA</creator><creatorcontrib>IWACHI HIROMI ; IINO YUJI ; HAYASHI KATSURA</creatorcontrib><description>PROBLEM TO BE SOLVED: To obtain a wiring board having a built-in electric element, excellent in reliability in connection between a built-in electric element and a wiring circuit layer provided on the wiring board. SOLUTION: A method for manufacturing the wiring board having a built-in electric component includes: a step of laminating a first resin precursor sheet having a cavity, a second resin precursor sheet having a conductor and arranged on one main surface side of the first resin precursor sheet and a third resin precursor sheet arranged on the other main surface side of the first resin precursor sheet in a state where the electric element having an electrode connected to the conductor is arranged in the cavity on the one main surface; and a step of forming the first, second and third resin precursor sheets into first, second and third insulation layers respectively by heating and shrinking the first, second and third resin precursor sheets, and fixing the electric element on the second and third insulation layers. COPYRIGHT: (C)2009,JPO&amp;INPIT</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090917&amp;DB=EPODOC&amp;CC=JP&amp;NR=2009212533A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090917&amp;DB=EPODOC&amp;CC=JP&amp;NR=2009212533A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IWACHI HIROMI</creatorcontrib><creatorcontrib>IINO YUJI</creatorcontrib><creatorcontrib>HAYASHI KATSURA</creatorcontrib><title>METHOD FOR MANUFACTURING WIRING BOARD HAVING BUILT-IN ELECTRIC ELEMENT</title><description>PROBLEM TO BE SOLVED: To obtain a wiring board having a built-in electric element, excellent in reliability in connection between a built-in electric element and a wiring circuit layer provided on the wiring board. SOLUTION: A method for manufacturing the wiring board having a built-in electric component includes: a step of laminating a first resin precursor sheet having a cavity, a second resin precursor sheet having a conductor and arranged on one main surface side of the first resin precursor sheet and a third resin precursor sheet arranged on the other main surface side of the first resin precursor sheet in a state where the electric element having an electrode connected to the conductor is arranged in the cavity on the one main surface; and a step of forming the first, second and third resin precursor sheets into first, second and third insulation layers respectively by heating and shrinking the first, second and third resin precursor sheets, and fixing the electric element on the second and third insulation layers. COPYRIGHT: (C)2009,JPO&amp;INPIT</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDzdQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXCPcEU07-jkEuCh6OYWBOqKdPiK6nn4Krj6tzSJCnM4jh6-oXwsPAmpaYU5zKC6W5GZTcXEOcPXRTC_LjU4sLEpNT81JL4r0CjAwMLI0MjUyNjR2NiVIEAP2sLKE</recordid><startdate>20090917</startdate><enddate>20090917</enddate><creator>IWACHI HIROMI</creator><creator>IINO YUJI</creator><creator>HAYASHI KATSURA</creator><scope>EVB</scope></search><sort><creationdate>20090917</creationdate><title>METHOD FOR MANUFACTURING WIRING BOARD HAVING BUILT-IN ELECTRIC ELEMENT</title><author>IWACHI HIROMI ; IINO YUJI ; HAYASHI KATSURA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2009212533A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>IWACHI HIROMI</creatorcontrib><creatorcontrib>IINO YUJI</creatorcontrib><creatorcontrib>HAYASHI KATSURA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IWACHI HIROMI</au><au>IINO YUJI</au><au>HAYASHI KATSURA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MANUFACTURING WIRING BOARD HAVING BUILT-IN ELECTRIC ELEMENT</title><date>2009-09-17</date><risdate>2009</risdate><abstract>PROBLEM TO BE SOLVED: To obtain a wiring board having a built-in electric element, excellent in reliability in connection between a built-in electric element and a wiring circuit layer provided on the wiring board. SOLUTION: A method for manufacturing the wiring board having a built-in electric component includes: a step of laminating a first resin precursor sheet having a cavity, a second resin precursor sheet having a conductor and arranged on one main surface side of the first resin precursor sheet and a third resin precursor sheet arranged on the other main surface side of the first resin precursor sheet in a state where the electric element having an electrode connected to the conductor is arranged in the cavity on the one main surface; and a step of forming the first, second and third resin precursor sheets into first, second and third insulation layers respectively by heating and shrinking the first, second and third resin precursor sheets, and fixing the electric element on the second and third insulation layers. COPYRIGHT: (C)2009,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2009212533A
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title METHOD FOR MANUFACTURING WIRING BOARD HAVING BUILT-IN ELECTRIC ELEMENT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T16%3A34%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=IWACHI%20HIROMI&rft.date=2009-09-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2009212533A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true