SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR MANUFACTURING/INSPECTING DEVICE AND INSPECTING DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device which has a Cu wiring containing a basic crystal structure which is not affected by variation in wiring width and capable of reducing a surface defect to a level lower than a practicable level, and to provide its inspecting technique. SOLUTION:...

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Bibliographische Detailangaben
Hauptverfasser: TAKADA YUJI, FUJIWARA TETSUO, HIROSE YUKINORI, NAKANO HIROSHI, SUDO KEIKI, KATO TAKAHIKO, SUGANO ITARU, SHONO TOMOTAKA, AKABOSHI HARUO
Format: Patent
Sprache:eng
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